The present disclosure reduces parasitic inductances of current paths between components. First conductor path is provided on a surface of insulating layer. One of a power supply voltage and a ground voltage is applied to first conductor path. Second conductor path is provided on the surface of insulating layer. The other of the power supply voltage and the ground voltage is applied to second conductor path. First switching element is connected to output pattern and to first conductor path. Second switching element is connected to output pattern and to second conductor path. At least one of first conductor path and second conductor path has a continuous annular path.