Invention Grant
- Patent Title: Heating system and method for microfluidic and micromechanical applications
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Application No.: US15234312Application Date: 2016-08-11
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Publication No.: US10654714B2Publication Date: 2020-05-19
- Inventor: Ming Fang , Fuchao Wang
- Applicant: STMICROELECTRONICS, INC.
- Applicant Address: US TX Coppell
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: US TX Coppell
- Agency: Seed Intellectual Property Law Group LLP
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B41J2/14 ; B41J2/16 ; B81B1/00 ; H01L49/02

Abstract:
An integrated semiconductor heating assembly includes a semiconductor substrate, a chamber formed therein, and an exit port in fluid communication with the chamber, allowing fluid to exit the chamber in response to heating the chamber. The integrated heating assembly includes a first heating element adjacent the chamber, which can generate heat above a selected threshold and bias fluid in the chamber toward the exit port. A second heating element is positioned adjacent the exit port to generate heat above a selected threshold, facilitating movement of the fluid through the exit port away from the chamber. Addition of the second heating element reduces the amount of heat emitted per heating element and minimizes thickness of a heat absorption material toward an open end of the exit port. Since such material is expensive, this reduces the manufacturing cost and retail price of the assembly while improving efficiency and longevity thereof.
Public/Granted literature
- US20160347610A1 HEATING SYSTEM AND METHOD FOR MICROFLUIDIC AND MICROMECHANICAL APPLICATIONS Public/Granted day:2016-12-01
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