The present disclosure relates to a bonding glass which has improved water resistance and has a coefficient of thermal expansion α(25-300) of from 14·10−6K−1 to 17·10−6K−1, comprising, in mol % on an oxide basis, 5-7 of B2O3, 10-14 of Al2O3, 36-43 of P2O5, 15-22 of Na2O, 12.5-20 of K2O, 2-6 of Bi2O3 and >0-6 of R oxide, where R oxide is an oxide selected from the group consisting of MnO2 and SiO2 and SnO2 and Ta2O5 and Nb2O5 and Fe2O3 and GeO2 and CaO. The bonding glass is free of PbO except for, at most, impurities. The bonding glass may have a glass transition temperature Tg of from 390° C. to 430° C. The present disclosure also relates to uses of this bonding glass.