Invention Grant
- Patent Title: Wafer defect inspection and review systems
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Application No.: US15279053Application Date: 2016-09-28
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Publication No.: US10656098B2Publication Date: 2020-05-19
- Inventor: Shiyu Zhang
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G01N21/95
- IPC: G01N21/95 ; G02B17/00 ; G02B13/22 ; G02B21/04 ; G02B17/08

Abstract:
Imaging objectives and inspection systems equipped with such imaging objectives are disclosed. The imaging objective may include a front objective configured to produce a diffraction limited intermediate image. The imaging objective may also include a relay configured to receive the intermediate image produced by the front objective. The relay may include three spherical mirrors positioned to deliver a projection of the intermediate image to a fixed image plane.
Public/Granted literature
- US20170219807A1 Wafer Defect Inspection and Review Systems Public/Granted day:2017-08-03
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