Invention Grant
- Patent Title: Electronic component and board having the same
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Application No.: US16193436Application Date: 2018-11-16
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Publication No.: US10658118B2Publication Date: 2020-05-19
- Inventor: Heung Kil Park , Se Hun Park , Gu Won Ji
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2bc1a20a com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7770607a
- Main IPC: H01G4/248
- IPC: H01G4/248 ; H05K1/18 ; H01G4/232 ; H01G4/30 ; H01G4/12 ; H05K1/11

Abstract:
An electronic component includes a capacitor body, and first and second external electrodes disposed and spaced apart from each other on a mounting surface of the capacitor body. The electronic component further includes first and second connection terminals respectively connected to the first and second external electrodes and having first and second cutouts, respectively. The electronic component also includes a first plating layer covering the first external electrode and the first connection terminal, and a second plating layer covering the second external electrode and the second connection terminal.
Public/Granted literature
- US20190252121A1 ELECTRONIC COMPONENT AND BOARD HAVING THE SAME Public/Granted day:2019-08-15
Information query