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    Multilayer electronic component and board having the same
    2.
    发明授权
    Multilayer electronic component and board having the same 有权

    公开(公告)号：US10438748B2

    公开(公告)日：2019-10-08

    申请号：US16248078

    申请日：2019-01-15

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Gu Won Ji ,  Heung Kil Park ,  Se Hun Park

    IPC: H01G4/30 ,  H01G4/248 ,  H05K1/18 ,  H05K1/11 ,  H05K3/30 ,  H05K1/02

    Abstract: A multilayer electronic component includes a capacitor body, first and second external electrodes, first and second land portions, and first and second insulating portions. The first and second external electrodes are disposed and spaced apart from each other on a mounting surface of the capacitor body. The first and second land portions include a conductive material and are disposed on the first and second external electrodes, respectively. The first and second insulating portions are disposed between the first and second land portions on the mounting surface of the capacitor body to be spaced apart from each other and each have one end connected to a respective one of the first and second land portions. A board having a multilayer electronic component includes a circuit board having first and second electrode pads disposed on one surface thereof, and the multilayer electronic component mounted thereon.

    Stress and moisture resistant capacitor and method of manufacturing the same
    3.
    发明授权
    Stress and moisture resistant capacitor and method of manufacturing the same 有权

    公开(公告)号：US10297387B2

    公开(公告)日：2019-05-21

    申请号：US15453167

    申请日：2017-03-08

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Kil Park ,  Jong Hwan Park ,  Se Hun Park

    IPC: H01G4/224 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H01G4/248 ,  B60R16/023 ,  H01G4/12

    Abstract: A capacitor includes a body including a dielectric layer, first internal electrodes and second internal electrodes. Each of the first internal electrodes and each of the second internal electrodes are alternately disposed with the dielectric layer interposed therebetween. A first connection electrode is disposed on a first end surface of the body to connect an end of the first internal electrodes. A second connection electrode is disposed on a second end surface of the body opposite to the first end surface to connect an end of the second internal electrodes. A first insulating layer is disposed on one surface of the body. A first terminal electrode and a second terminal electrode are respectively disposed on opposing end surfaces of the first insulating layer to connect the first connection electrode and the second connection electrode, respectively. A second insulating layer is disposed on another surface of the body.

    Multilayer Electronic Component and Board Having the Same
    4.
    发明申请
    Multilayer Electronic Component and Board Having the Same 审中-公开

    公开(公告)号：US20190148071A1

    公开(公告)日：2019-05-16

    申请号：US16248078

    申请日：2019-01-15

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Gu Won Ji ,  Heung Kil Park ,  Se Hun Park

    IPC: H01G4/248 ,  H05K1/11 ,  H05K1/18 ,  H01G4/30

    CPC classification number: H01G4/248 ,  H01G4/30 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/181 ,  H05K3/301 ,  H05K2201/10015

    Abstract: A multilayer electronic component includes a capacitor body, first and second external electrodes, first and second land portions, and first and second insulating portions. The first and second external electrodes are disposed and spaced apart from each other on a mounting surface of the capacitor body. The first and second land portions include a conductive material and are disposed on the first and second external electrodes, respectively. The first and second insulating portions are disposed between the first and second land portions on the mounting surface of the capacitor body to be spaced apart from each other and each have one end connected to a respective one of the first and second land portions. A board having a multilayer electronic component includes a circuit board having first and second electrode pads disposed on one surface thereof, and the multilayer electronic component mounted thereon.

    Multilayer electronic component and board having the same
    5.
    发明授权
    Multilayer electronic component and board having the same 有权

    公开(公告)号：US10204739B1

    公开(公告)日：2019-02-12

    申请号：US15850933

    申请日：2017-12-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Gu Won Ji ,  Heung Kil Park ,  Se Hun Park

    IPC: H01G4/248 ,  H05K1/18 ,  H01G4/30 ,  H05K1/11

    Abstract: A multilayer electronic component includes a capacitor body, first and second external electrodes, first and second land portions, and first and second insulating portions. The first and second external electrodes are disposed and spaced apart from each other on a mounting surface of the capacitor body. The first and second land portions include a conductive material and are disposed on the first and second external electrodes, respectively. The first and second insulating portions are disposed between the first and second land portions on the mounting surface of the capacitor body to be spaced apart from each other and each have one end connected to a respective one of the first and second land portions. A board having a multilayer electronic component includes a circuit board having first and second electrode pads disposed on one surface thereof, and the multilayer electronic component mounted thereon.

    Multilayer capacitor and board having the same mounted thereon
    6.
    发明授权
    Multilayer capacitor and board having the same mounted thereon 有权

    公开(公告)号：US10192685B2

    公开(公告)日：2019-01-29

    申请号：US15645601

    申请日：2017-07-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Kil Park ,  Jong Hwan Park ,  Se Hun Park ,  Young Ghyu Ahn

    IPC: H01G4/30 ,  H01G4/228 ,  H01G4/005 ,  H05K1/18 ,  H05K3/34

    Abstract: A multilayer capacitor includes a capacitor body including a plurality of first and second internal electrodes alternately disposed therein and a dielectric layer interposed therebetween, and having first to sixth surfaces, opposing each other, respectively; a plurality of external electrodes connected to the first and second internal electrodes; an insulating layer disposed on the first surface; first and second terminal electrodes spaced apart from each other in a direction in which the third and fourth surfaces are connected, on the insulating layer; and a connecting member electrically connecting the first and second terminal electrodes and the external electrodes.

    Electronic component
    8.
    发明授权
    Electronic component 有权

    公开(公告)号：US11056281B2

    公开(公告)日：2021-07-06

    申请号：US16552898

    申请日：2019-08-27

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Se Hun Park ,  Heung Kil Park ,  Gu Won Ji

    IPC: H01G4/30 ,  H01G4/248 ,  H01G4/232 ,  H01G4/012 ,  H01G4/12

    Abstract: An electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, having first to sixth surfaces, and including one ends of the first and second internal electrodes exposed through the third and fourth surfaces, respectively; first and second external electrodes respectively including first and second head portions, and first and second band portions; a first connection terminal having conductive portions disposed on both ends thereof and connected to the first and second band portions, respectively; and a second connection terminal having conductive portions on both ends thereof and connected to the first and second band portions, respectively. The second connection terminal is spaced apart from the first connection terminal in a direction connecting the fifth and sixth surfaces.

    ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON
    9.
    发明申请
    ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON 有权

    公开(公告)号：US20210065983A1

    公开(公告)日：2021-03-04

    申请号：US16854237

    申请日：2020-04-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Kil Park ,  Se Hun Park ,  Hun Gyu Park ,  Tae Hoon Kim ,  Gu Won Ji

    IPC: H01G4/248 ,  H01G4/30 ,  H01G4/232 ,  H05K1/11 ,  H05K1/18

    Abstract: A multilayer electronic component includes a capacitor body having first to six surfaces, the capacitor body including a dielectric layer and first and second internal electrodes having one ends exposed through the third and fourth sides, respectively, first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces of the capacitor body, respectively, and first and second band portions spaced apart from each other on the first surface of the capacitor body, respectively, a first connection terminal disposed on the first band portion and having a first cutout disposed in a lower surface thereof, open toward the third surface of the capacitor body, and a second connection terminal disposed on the second band portion and having a second cutout formed in a lower surface thereof, open toward the fourth surface of the capacitor body.

    Electronic component and board having the same
    10.
    发明授权
    Electronic component and board having the same 有权

    公开(公告)号：US10658118B2

    公开(公告)日：2020-05-19

    申请号：US16193436

    申请日：2018-11-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Kil Park ,  Se Hun Park ,  Gu Won Ji

    IPC: H01G4/248 ,  H05K1/18 ,  H01G4/232 ,  H01G4/30 ,  H01G4/12 ,  H05K1/11

    Abstract: An electronic component includes a capacitor body, and first and second external electrodes disposed and spaced apart from each other on a mounting surface of the capacitor body. The electronic component further includes first and second connection terminals respectively connected to the first and second external electrodes and having first and second cutouts, respectively. The electronic component also includes a first plating layer covering the first external electrode and the first connection terminal, and a second plating layer covering the second external electrode and the second connection terminal.

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