Invention Grant
- Patent Title: Process for forming a solid electrolytic capacitor
-
Application No.: US15787126Application Date: 2017-10-18
-
Publication No.: US10658121B2Publication Date: 2020-05-19
- Inventor: Ajaykumar Bunha , Antony P. Chacko , Qingping Chen , Yaru Shi , Philip M. Lessner
- Applicant: KEMET Electronics Corporation
- Applicant Address: US CA Simpsonville
- Assignee: KEMET Electronics Corporation
- Current Assignee: KEMET Electronics Corporation
- Current Assignee Address: US CA Simpsonville
- Agency: Patent Filing Specialist, Inc.
- Agent Joseph T. Guy
- Main IPC: H01G9/00
- IPC: H01G9/00 ; H01G9/042 ; C09D5/24 ; C09D165/00 ; C09D4/06 ; C09D125/18 ; C09D7/65 ; H01G9/15 ; H01G9/025

Abstract:
A capacitor and process for forming the capacitor, is provided wherein the capacitor comprises a conductive polymer layer. The conductive polymer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and said polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns and the second particles have an average particle diameter of at least 1 nm to no more than 600 nm.
Public/Granted literature
- US20190115158A1 Conductive Polymer Dispersion for Improved Reliability Public/Granted day:2019-04-18
Information query