Invention Grant
- Patent Title: Thermoelectric cooling packages and thermal management methods thereof
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Application No.: US15495324Application Date: 2017-04-24
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Publication No.: US10658266B2Publication Date: 2020-05-19
- Inventor: Jae Choon Kim , Jichul Kim , Jin-Kwon Bae , Eunseok Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3b7b6aa0
- Main IPC: H01L23/38
- IPC: H01L23/38 ; F25B21/02 ; H01L35/32 ; H01L25/10 ; H01L25/18 ; H01L23/00
Abstract:
A method for managing a temperature of a device includes determining a temperature of a circuit or a package including the circuit, and selectively operating a thermoelectric semiconductor based on the determined temperature to adjust the temperature of the circuit or the package.
Public/Granted literature
- US20170229373A1 THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF Public/Granted day:2017-08-10
Information query
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