Invention Grant
- Patent Title: Semiconductor device including a plurality of nitride semiconductor layers
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Application No.: US15306445Application Date: 2014-05-01
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Publication No.: US10658469B2Publication Date: 2020-05-19
- Inventor: Toshihiro Iizuka , Shin Koyama , Yoshitake Kato
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- International Application: PCT/JP2014/062095 WO 20140501
- International Announcement: WO2015/166572 WO 20151105
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L29/778 ; H01L29/78 ; H01L21/02 ; H01L29/205 ; H01L29/423 ; H01L29/51 ; H01L29/66

Abstract:
In a semiconductor device (MISFET) having a gate electrode formed over a nitride semiconductor layer with a gate insulating film interposed therebetween, the gate insulating film includes a first gate insulating film (oxide film of first metal) formed on the nitride semiconductor layer and a second gate insulating film (oxide film of second metal). The second metal (for example, Hf) has electronegativity lower than that of the first metal (for example, Al). Since the electronegativity of the second metal is lower than that of the first metal, negative charge is introduced into the oxide film of the first metal due to interfacial polarization, so that the flat-band voltage can be shifted in a positive direction. Accordingly, the threshold voltage which has become negative due to the heat treatment of the oxide film of the first metal can be shifted in the positive direction.
Public/Granted literature
- US20170047409A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2017-02-16
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