Invention Grant
- Patent Title: High efficiency LEDs and methods of manufacturing
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Application No.: US14602040Application Date: 2015-01-21
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Publication No.: US10658546B2Publication Date: 2020-05-19
- Inventor: Matthew Donofrio , Pritish Kar , Sten Heikman , Harshad Golakia , Rajeev Acharya , Yuvaraj Dora
- Applicant: CREE, INC.
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Ferguson Case Orr Paterson LLP
- Main IPC: H01L33/46
- IPC: H01L33/46 ; H01L33/14 ; H01L33/38 ; H01L33/00 ; H01L33/42

Abstract:
Simplified LED chip architectures or chip builds are disclosed that can result in simpler manufacturing processes using fewer steps. The LED structure can have fewer layers than conventional LED chips with the layers arranged in different ways for efficient fabrication and operation. The LED chips can comprise an active LED structure. A dielectric reflective layer is included adjacent to one of the oppositely doped layers. A metal reflective layer is on the dielectric reflective layer, wherein the dielectric and metal reflective layers extend beyond the edge of said active region. By extending the dielectric layer, the LED chips can emit with more efficiency by reflecting more LED light to emit in the desired direction. By extending the metal reflective layer beyond the edge of the active region, the metal reflective layer can serve as a current spreading layer and barrier, in addition to reflecting LED light to emit in the desired direction. The LED chips can also comprise self-aligned and self-limiting features that simplify etching processes during fabrication.
Public/Granted literature
- US20160211420A1 HIGH EFFICIENCY LEDS AND METHODS OF MANUFACTURING Public/Granted day:2016-07-21
Information query
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