Invention Grant
- Patent Title: Method, apparatus, and kit for assembling a mobile platform
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Application No.: US15437513Application Date: 2017-02-21
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Publication No.: US10661900B2Publication Date: 2020-05-26
- Inventor: Xumin Wu , Xiaolong Wu , Jiyuan Ao , Sungki Lee , Zhuang Feng
- Applicant: SZ DJI TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SZ DJI TECHNOLOGY CO., LTD.
- Current Assignee: SZ DJI TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Anova Law Group, PLLC
- Main IPC: B64D1/12
- IPC: B64D1/12 ; B64D1/18 ; B64C39/04 ; B64C39/02 ; B64C27/50

Abstract:
An apparatus and kit for assembling a mobile platform and methods for making and using the same. When associated with a mobile platform, a power device can be installed outside a control device coupled with the mobile platform. The power device can be located outside a housing enclosing the mobile platform and exposed to an external operating environment of the mobile platform. Heat generated by the power device can be dissipated without installation of additional cooling equipment. The power device and the control device can thus have lower operating temperatures and longer lifetimes. The power device can be installed on a module associated with the mobile platform for further improving heat dissipation of the power device. The module optionally can function as a shock absorber for preventing damage to the power device in case the mobile platform is involved in a crash.
Public/Granted literature
- US20170158331A1 METHOD, APPARATUS, AND KIT FOR ASSEMBLING A MOBILE PLATFORM Public/Granted day:2017-06-08
Information query
IPC分类: