Method of examining locations in a wafer with adjustable navigation accuracy and system thereof
Abstract:
Data indicative of alignment targets may be received. Each alignment target may be associated with a target location on an object. Locations of the object to be inspected may be identified. An alignment target from the alignment targets may be selected. Each of the locations may be within a determined distance from the selected alignment target. An indication may be provided to align the object relative to an examination tool for inspecting the locations within the determined distance from the selected alignment target.
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