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公开(公告)号：US11205119B2
公开(公告)日：2021-12-21
申请号：US15384058
申请日：2016-12-19
发明人： Leonid Karlinsky , Boaz Cohen , Idan Kaizerman , Efrat Rosenman , Amit Batikoff , Daniel Ravid , Moshe Rosenweig
摘要： There are provided system and method of examining a semiconductor specimen. The method comprises: upon obtaining a Deep Neural Network (DNN) trained for a given examination-related application within a semiconductor fabrication process, processing together one or more fabrication process (FP) images using the obtained trained DNN, wherein the DNN is trained using a training set comprising ground truth data specific for the given application; and obtaining examination-related data specific for the given application and characterizing at least one of the processed one or more FP images. The examination-related application can be, for example, classifying at least one defect presented by at least one FP image, segmenting the at least one FP image, detecting defects in the specimen presented by the at least one FP image, registering between at least two FP images, regression application enabling reconstructing the at least one FP image in correspondence with different examination modality, etc.
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公开(公告)号：US11010665B2
公开(公告)日：2021-05-18
申请号：US15668623
申请日：2017-08-03
发明人： Leonid Karlinsky , Boaz Cohen , Idan Kaizerman , Efrat Rosenman , Amit Batikoff , Daniel Ravid , Moshe Rosenweig
摘要： There are provided system and method of segmentation a fabrication process (FP) image obtained in a fabrication of a semiconductor specimen. The method comprises: upon obtaining a Deep Neural Network (DNN) trained to provide segmentation-related data, processing a fabrication process (FP) sample using the obtained trained DNN and, resulting from the processing, obtaining by the computer segments-related data characterizing the FP image to be segmented, the obtained segments-related data usable for automated examination of the semiconductor specimen. The DNN is trained using a segmentation training set comprising a plurality of first training samples and ground truth data associated therewith, each first training sample comprises a training image; FP sample comprises the FP image to be segmented.
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公开(公告)号：US10748271B2
公开(公告)日：2020-08-18
申请号：US15962909
申请日：2018-04-25
发明人： Assaf Asbag , Orly Zvitia , Idan Kaizerman , Efrat Rosenman
摘要： There are provided system and method of classifying defects in a specimen. The method includes: obtaining one or more defect clusters detected on a defect map of the specimen, each cluster characterized by a set of cluster attributes comprising spatial attributes including spatial density indicative of density of defects in one or more regions accommodating the cluster, each given defect cluster being detected at least based on the spatial density thereof meeting a criterion; for each cluster, applying a cluster classifier to a respective set of cluster attributes thereof to associate the cluster with one or more labels of a predefined set of labels, wherein the cluster classifier is trained using cluster training data; and identifying DOI in each cluster by performing a defect filtration for each cluster using one or more filtering parameters specified in accordance with the label of the cluster.
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公开(公告)号：US20190012781A1
公开(公告)日：2019-01-10
申请号：US16102112
申请日：2018-08-13
发明人： Saar Shabtay , Idan Kaizerman , Amir Watchs
摘要： Data indicative of a group of defect candidates may be obtained. The data may be indicative of a group of defect candidates and may include values of attributes for each defect candidate of the group of defect candidates. Sub-groups of defect candidates may be iteratively selected for review using a review recipe to classify the defect candidates in each selected sub-group based on the values of attributes of respective defect candidates and classification results of previously reviewed defect candidates. The sub-groups may be selected until a sampling stop condition is fulfilled to obtain a classification output for the wafer. Instructions specifying at least one of the sampling stop condition, the inspection recipe, or the review recipe may be altered and additional defect candidates in a next wafer may be classified by using the altered instructions.
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公开(公告)号：US09715724B2
公开(公告)日：2017-07-25
申请号：US14446295
申请日：2014-07-29
发明人： Ishai Schwarzband , Yan Ivanchenko , Daniel Ravid , Orly Zvitia , Idan Kaizerman
CPC分类号： G06T7/001 , G06K9/4604 , G06K9/6211 , G06K2209/19 , G06K2209/403 , G06T2207/10028 , G06T2207/10061 , G06T2207/30148
摘要： A method for image processing includes providing a microscopic image of a structure fabricated on a substrate and computer-aided design (CAD) data used in fabricating the structure. The microscopic image is processed by a computer so as to generate a first directionality map, which includes, for a matrix of points in the microscopic image, respective directionality vectors corresponding to magnitudes and directions of edges at the points irrespective of a sign of the magnitudes. The CAD data are processed by the computer so as to produce a simulated image based on the CAD data and to generate a second directionality map based on the simulated image. The first and second directionality maps are compared by the computer so as to register the microscopic image with the CAD data.
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公开(公告)号：US10720367B2
公开(公告)日：2020-07-21
申请号：US16429533
申请日：2019-06-03
发明人： Idan Kaizerman , Yotam Sofer
IPC分类号： H01L21/66 , H01J37/28 , H01J37/22 , G03F7/20 , H01J37/317 , H01J37/304
摘要： A method for process analysis includes acquiring first inspection data, using a first inspection modality, with respect to a substrate having multiple instances of a predefined pattern of features formed thereon using different, respective sets of process parameters. Characteristics of defects identified in the first inspection data are processed so as to select a first set of defect locations in which the first inspection data are indicative of an influence of the process parameters on the defects. Second inspection data are acquired, using a second inspection modality having a finer resolution than the first inspection modality, of the substrate at the locations in the first set. The defects appearing in the second inspection data are analyzed so as to select, from within the first set of the locations, a second set of the locations in which the second inspection data are indicative of an optimal range of the process parameters.
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公开(公告)号：US10190991B2
公开(公告)日：2019-01-29
申请号：US15343090
申请日：2016-11-03
发明人： Yotam Sofer , Idan Kaizerman
摘要： Examining an object, comprising: receiving potential defects, each associated with a location; performing first clustering of the potential defects to obtain first and second subsets, the clustering performed such that potential defects in the first subset are denser in a physical area than potential defects in the second subset; automatically assigning first validity probabilities to potential defects in the first and second subsets; selecting for review potential defects from the first and second subsets, according to a third policy, and in accordance with a strategy for combining top elements and randomly selected elements from the merged list; receiving indications for potential defects in part of the potential defect lists, subsequent to potential defects being reviewed; updating the policies in accordance with validation or classification of items in the first and second subsets; and repeating said assigning, selecting, receiving and updating with the updated policies, until a stopping criteria is observed.
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8.发明授权公开(公告)号：US10161882B1
公开(公告)日：2018-12-25
申请号：US15222824
申请日：2016-07-28
发明人： Idan Kaizerman , Mark Geshel
摘要： A method, computerized system and computer program product for examining an object using a processor operatively connected to a memory, the method comprising: accommodating in the memory data indicative of a plurality of alignment targets, each alignment target associated with a target location on an object; accommodating in the memory a plurality of locations to be captured; and selecting by the processor an alignment target subset of the plurality of alignment targets, such that each of the plurality of locations is associated with and is within a determined distance from a single alignment target from the alignment target subset, the distance determined in accordance with a provided field of view, and wherein the alignment target subset comprises fewer targets than locations to be reviewed, the alignment target being usable for aligning the object relative to an examination tool for capturing the locations associated with the single alignment target.
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公开(公告)号：US20160163038A1
公开(公告)日：2016-06-09
申请号：US15019894
申请日：2016-02-09
发明人： Saar Shabtay , Idan Kaizerman , Amir Wachs
CPC分类号： G06T7/0004 , G06K9/52 , G06K9/685 , G06K2009/4666 , G06T7/0012 , G06T2207/10056 , G06T2207/20112 , G06T2207/30148
摘要： A method for classifying defects of a wafer, the method is executed by a computerized system, the method may include obtaining defect candidate information about a group of defect candidates, wherein the defect candidate information comprises values of attributes per each defect candidate of the group; selecting, by a processor of the computerized system, a selected sub-group of defect candidates in response to values of attributes of defect candidates that belong to at least the selected sub-group; classifying defect candidates of the selected sub-group to provide selected sub-group classification results; repeating, until fulfilling a stop condition: selecting an additional selected sub-group of defect candidates in response to (a) values of attributes of defect candidates that belong to at least the additional selected sub-group; and (b) classification results obtained from classifying at least one other selected sub-group; and classifying defect candidates of the additional selected sub-group to provide additional selected sub-group classification results.
摘要翻译： 一种用于分类晶片缺陷的方法，所述方法由计算机化系统执行，所述方法可以包括获得关于缺陷候选组的缺陷候选信息，其中所述缺陷候选信息包括所述组中每个缺陷候选的属性值; 响应于属于至少所选择的子组的缺陷候选的属性的值，由所述计算机化系统的处理器选择所选择的缺陷候选子组; 对所选子组的缺陷候选进行分类，以提供选定的子组分类结果; 重复，直到完成停止条件：响应于（a）至少属于附加选择的子组的缺陷候选的属性值，选择附加的选择的缺陷候选子组; 和（b）从至少一个其他选择的子组分类获得的分类结果; 并对附加选择的子组的缺陷候选进行分类，以提供附加的选择的子组分类结果。
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公开(公告)号：US09286675B1
公开(公告)日：2016-03-15
申请号：US14522543
申请日：2014-10-23
发明人： Saar Shabtay , Idan Kaizerman , Amir Wachs
CPC分类号： G06T7/0004 , G06K9/52 , G06K9/685 , G06K2009/4666 , G06T7/0012 , G06T2207/10056 , G06T2207/20112 , G06T2207/30148
摘要： A method for classifying defects of a wafer, the method is executed by a computerized system, the method may include obtaining defect candidate information about a group of defect candidates, wherein the defect candidate information comprises values of attributes per each defect candidate of the group; selecting, by a processor of the computerized system, a selected sub-group of defect candidates in response to values of attributes of defect candidates that belong to at least the selected sub-group; classifying defect candidates of the selected sub-group to provide selected sub-group classification results; repeating, until fulfilling a stop condition: selecting an additional selected sub-group of defect candidates in response to (a) values of attributes of defect candidates that belong to at least the additional selected sub-group; and (b) classification results obtained from classifying at least one other selected sub-group; and classifying defect candidates of the additional selected sub-group to provide additional selected sub-group classification results.
摘要翻译： 一种用于分类晶片缺陷的方法，所述方法由计算机化系统执行，所述方法可以包括获得关于缺陷候选组的缺陷候选信息，其中所述缺陷候选信息包括所述组中每个缺陷候选的属性值; 响应于属于至少所选择的子组的缺陷候选的属性的值，由所述计算机化系统的处理器选择所选择的缺陷候选子组; 对所选子组的缺陷候选进行分类，以提供选定的子组分类结果; 重复，直到完成停止条件：响应于（a）至少属于附加选择的子组的缺陷候选的属性值，选择附加的选择的缺陷候选子组; 和（b）从至少一个其他选择的子组分类获得的分类结果; 并对附加选择的子组的缺陷候选进行分类，以提供附加的选择的子组分类结果。
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