Embodiments provide a printed circuit board including a copper foil layer to form a circuit pattern on a base layer, and an insulation layer laminated on the copper foil layer, and wherein the circuit pattern includes a solder pattern, to which an inverter switch element is soldered to supply drive power to a motor, a heat radiation pattern spaced apart from the solder pattern and to contact with one surface of the inverter switch element so as to absorb and radiate heat in the inverter switch element, a heat circulation pattern, through which the heat absorbed by the heat radiation pattern is circulated, and an element pattern formed on both sides of the heat circulation pattern to allow a thermistor element, a resistance value of which is varied according to the heat, to be soldered to the element pattern.