Invention Grant
- Patent Title: Circuit board and conductive pattern structure
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Application No.: US16266705Application Date: 2019-02-04
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Publication No.: US10667386B2Publication Date: 2020-05-26
- Inventor: Han Kim , Seong Hee Choi , Dae Hyun Park
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@76b216b8
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01P3/08
Abstract:
A circuit board includes a first conductive layer, a second conductive layer, and a first insulating layer disposed between the first conductive layer and the second conductive layer, wherein the first conductive layer includes a signal line, the second conductive layer includes a ground line, and the ground line of the second conductive layer includes a pattern area patterned in a meander shape.
Public/Granted literature
- US20190182950A1 CIRCUIT BOARD AND CONDUCTIVE PATTERN STRUCTURE Public/Granted day:2019-06-13
Information query
