-
公开(公告)号：US10217631B2
公开(公告)日：2019-02-26
申请号：US15673149
申请日：2017-08-09
发明人： Han Kim , Mi Ja Han , Dae Hyun Park , Sang Jong Lee , Seong Hee Choi
IPC分类号： H01L21/02 , H01L21/48 , H01L21/56 , H01L21/768 , H01L23/00 , H01L23/552
摘要： A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads. The first connection member includes a first electromagnetic interference (EMI) blocking part surrounding side surfaces of the semiconductor chip, the second connection member includes a second EMI blocking part surrounding the redistribution layer, and the first EMI blocking part and the second EMI blocking part are connected to each other.
-
公开(公告)号：US09496594B2
公开(公告)日：2016-11-15
申请号：US14464362
申请日：2014-08-20
发明人： Dae Hyun Park , Han Kim , Seong Hee Choi , Mi Ja Han
CPC分类号： H01P5/19 , H01L23/64 , H01P3/08 , H03H7/38 , H05K1/0245 , H05K1/0253 , H05K2201/09263
摘要： A printed circuit board includes a signal transmitting part and a ground part disposed having an insulating layer therebetween. The ground part includes an impedance adjusting part.
摘要翻译： 印刷电路板包括信号传输部分和设置在它们之间的绝缘层的接地部分。 接地部包括阻抗调整部。
-
公开(公告)号：US10971821B2
公开(公告)日：2021-04-06
申请号：US16454605
申请日：2019-06-27
发明人： Seong Hee Choi , Sang Jong Lee
摘要： A chip antenna module includes: a chip antenna including a body portion, a radiating portion, and a grounding portion, wherein the body portion is formed of a dielectric substance, and wherein the radiating portion and the grounding portion are disposed on different surfaces of the body portion from each other; and a substrate having a plurality of layers and including feeding pads bonded to the radiating portion, grounding pads bonded to the grounding portion, and dummy wiring layers disposed on at least one layer among the plurality of layers, below the feeding pads, wherein a resonance frequency of the chip antenna is determined by a number of the dummy wiring layers.
-
公开(公告)号：US10475751B2
公开(公告)日：2019-11-12
申请号：US16120150
申请日：2018-08-31
发明人： Seong Hee Choi , Han Kim , Hyung Joon Kim , Mi Ja Han
IPC分类号： H01L23/552 , H01L23/31 , H01L23/538 , H01L23/00 , H01L21/48 , H01L21/56 , H01L21/683
摘要： A fan-out semiconductor package includes: a core member having at least one through-hole formed therein and having a metal layer disposed on an internal surface thereof; an electronic component disposed in the through-hole; an encapsulant encapsulating the core member and the electronic component; a metal plate disposed on an upper surface of the encapsulant; and a wall penetrating the encapsulant to connect the metal layer and the metal plate to each other. The wall includes sections spaced apart from each other.
-
公开(公告)号：US11139551B2
公开(公告)日：2021-10-05
申请号：US16506289
申请日：2019-07-09
发明人： Seong Hee Choi , Sang Jong Lee
摘要： A chip antenna module includes: a substrate including a feed wiring layer to provide a feed signal, a feeding via connected to the feed wiring layer, and a dummy via separated from the feed wiring layer; and a chip antenna disposed on a first surface of the substrate and including a body portion formed of a dielectric substance, a radiating portion that extends from a first surface of the body portion and is connected to the feeding via and the dummy via, and a grounding portion that extends from a second surface of the body portion opposite the first surface of the body portion.
-
公开(公告)号：US10978785B2
公开(公告)日：2021-04-13
申请号：US16456048
申请日：2019-06-28
发明人： Seong Hee Choi , Sang Jong Lee , Sung Yong An , Jae Yeong Kim , Ju Hyoung Park
摘要： An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.
-
公开(公告)号：US09853003B1
公开(公告)日：2017-12-26
申请号：US15480573
申请日：2017-04-06
发明人： Mi Ja Han , Seong Hee Choi , Han Kim , Moon Il Kim , Dae Hyun Park
CPC分类号： H01L23/645 , H01L23/3128 , H01L24/02 , H01L24/13 , H01L24/19 , H01L24/20 , H01L2224/02331 , H01L2224/02373 , H01L2224/02379 , H01L2224/02381 , H01L2224/04105 , H01L2224/12105 , H01L2224/13024 , H01L2224/24195 , H01L2225/1035 , H01L2225/1041 , H01L2924/10252 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/1432 , H01L2924/14335 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3025 , H01L2924/37001
摘要： A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip. The first connection member and the second connection member include, respectively, redistribution layers electrically connected to the connection pads of the semiconductor chip, and the first connection member includes a coil pattern layer electrically connected to the connection pads of the semiconductor chip.
-
公开(公告)号：US11018418B2
公开(公告)日：2021-05-25
申请号：US16185118
申请日：2018-11-09
发明人： Jae Yeong Kim , Sung Yong An , Sang Jong Lee , Seong Hee Choi , Kyu Bum Han , Jeong Ki Ryoo , Byeong Cheol Moon , Chang Hak Choi
IPC分类号： H01Q1/38 , H01Q15/14 , H01Q9/04 , H01Q1/48 , H01Q1/22 , H01Q19/30 , H01Q11/02 , H01Q1/24 , H01Q19/00
摘要： A chip antenna includes a radiation portion having a block shape and a first surface and a second surface opposing each other, and configured to receive and radiate a feed signal as an electromagnetic wave; a first block made of a dielectric material and coupled to the first surface of the radiation portion; a second block made of a dielectric material and coupled to the second surface of the radiation portion; a ground portion having a block shape and coupled to the first block, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and a director having a block shape and coupled to the second block, wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less, and the first block has a dielectric constant of 3.5 or more to 25 or less.
-
公开(公告)号：US10667386B2
公开(公告)日：2020-05-26
申请号：US16266705
申请日：2019-02-04
发明人： Han Kim , Seong Hee Choi , Dae Hyun Park
摘要： A circuit board includes a first conductive layer, a second conductive layer, and a first insulating layer disposed between the first conductive layer and the second conductive layer, wherein the first conductive layer includes a signal line, the second conductive layer includes a ground line, and the ground line of the second conductive layer includes a pattern area patterned in a meander shape.
-
公开(公告)号：US10251259B2
公开(公告)日：2019-04-02
申请号：US15198679
申请日：2016-06-30
发明人： Han Kim , Seong Hee Choi , Dae Hyun Park
摘要： A circuit board includes a first conductive layer, a second conductive layer, and a first insulating layer disposed between the first conductive layer and the second conductive layer, wherein the first conductive layer includes a signal line, the second conductive layer includes a ground line, and the ground line of the second conductive layer includes a pattern area patterned in a meander shape.
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.019 秒)
