- 专利标题: Adhesive resin composition and laminate
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申请号: US16052617申请日: 2018-08-02
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公开(公告)号: US10669456B2公开(公告)日: 2020-06-02
- 发明人: Hirokazu Iizuka , Kunihiro Takei , Jun Suzuki
- 申请人: FUJIMORI KOGYO CO., LTD.
- 申请人地址: JP Tokyo
- 专利权人: FUJIMORI KOGYO CO., LTD.
- 当前专利权人: FUJIMORI KOGYO CO., LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Hauptman Ham, LLP
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3168d895
- 主分类号: C09J123/26
- IPC分类号: C09J123/26 ; C09J151/06
摘要:
Provided are an adhesive resin composition that can be uniformly applied, has high adhesiveness, and further has high strength in acid resistance, and a laminate including the same. Provided is an adhesive resin composition including an acid-modified polyolefin resin component having a melting point of higher than 80° C. and 140° C. or lower, a crosslinking agent component, and a solvent component, in which the solvent component contains an aromatic solvent, an aliphatic solvent, and a ketone-based solvent, the aromatic solvent has a highest boiling point, and the solvent component contains the aromatic solvent in an amount of 50 parts by mass or more and 80 parts by mass or less, the aliphatic solvent in an amount of 10 parts by mass or more and 30 parts by mass or less, and the ketone-based solvent in an amount of 5 parts by mass or more and 20 parts by mass or less, based on 100 parts by mass of a total amount of the solvent component.
公开/授权文献
- US20190062605A1 ADHESIVE RESIN COMPOSITION AND LAMINATE 公开/授权日:2019-02-28
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