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公开(公告)号：US20240271010A1
公开(公告)日：2024-08-15
申请号：US18570516
申请日：2022-06-15
发明人： Kunihiro Takei , Yuiko Yoshikawa
IPC分类号： C09J7/25 , B29C48/00 , B29C48/08 , B29C48/21 , B29K21/00 , B29K23/00 , B29K25/00 , B29K105/00 , B32B27/08 , B32B27/28 , B32B27/30 , B32B27/32 , C08J5/18 , C09J7/30 , C09J123/12
CPC分类号： C09J7/25 , B29C48/0021 , B29C48/022 , B29C48/08 , B29C48/21 , B32B27/08 , B32B27/285 , B32B27/302 , B32B27/32 , C08J5/18 , C09J7/30 , C09J123/12 , B29K2021/003 , B29K2023/06 , B29K2023/12 , B29K2025/06 , B29K2105/0002 , B29K2105/0097 , B29K2995/0016 , B32B2250/24 , B32B2270/00 , B32B2307/306 , B32B2307/748 , B32B2405/00 , C08J2371/12 , C08J2423/12 , C08J2425/10 , C08J2481/04 , C09J2423/10 , C09J2425/00 , C09J2471/006
摘要： The present invention provides an adhesive film having an adhesive layer on at least one surface of a heat-resistant layer, in which the heat-resistant layer contains a thermoplastic resin having an aromatic ring in a monomer unit as an essential component, a heat deflection temperature of the heat-resistant layer is 100° C. or higher, and the adhesive layer contains a modified polyolefin resin as an essential component and, furthermore, contains at least one resin having a styrene structure or a cyclic hydrocarbon structure.
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公开(公告)号：US12116509B2
公开(公告)日：2024-10-15
申请号：US17274884
申请日：2019-09-10
发明人： Kunihiro Takei , Hirokazu Iizuka
IPC分类号： C09J7/35 , C09J7/24 , C09J7/25 , C09J123/26
CPC分类号： C09J7/35 , C09J7/243 , C09J7/255 , C09J123/26 , C09J2301/122 , C09J2301/304 , C09J2423/006 , C09J2423/10 , C09J2423/106 , C09J2461/00 , C09J2467/006 , C09J2479/086 , C09J161/06 , C08L51/06 , C08L63/04 , C09J161/06 , C08L51/06 , C08L75/04 , C09J2451/00 , C09J2461/00
摘要： A hot-melt adhesive resin composition includes a modified polyolefin in which a functional group is introduced into a polyolefin, a solid phenol resin, and a crosslinking agent, wherein the content of the modified polyolefin is 10 parts by mass or more and 40 parts by mass or less, based on 100 parts by mass of the total of the modified polyolefin and the solid phenol resin, and the modified polyolefin and the crosslinking agent are mixed so that a functional group possessed by the crosslinking agent is more than 1.0 equivalent and 5.0 equivalents or less, based on 1.0 equivalent of a functional group possessed by the modified polyolefin.
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公开(公告)号：US11148401B2
公开(公告)日：2021-10-19
申请号：US15748995
申请日：2016-08-03
发明人： Kunihiro Takei , Yuiko Maruyama , Hirokazu Iizuka
IPC分类号： B32B7/12 , B32B27/08 , B32B27/32 , C09D123/26 , C09D5/00 , C09J123/26 , C09J201/00 , B32B27/00 , C09J151/06 , B32B37/00 , C09J7/29 , C09J7/35 , B32B27/20 , B32B27/30 , B32B27/34 , B32B27/36 , B32B27/38 , B32B37/12 , B32B37/18
摘要： The present invention relates to a hot-melt adhesive resin film having an excellent adhesive force and durability to various adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order, in which the first intermediate layer and the second intermediate layer include a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and a production method thereof.
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公开(公告)号：US11939492B2
公开(公告)日：2024-03-26
申请号：US17744191
申请日：2022-05-13
发明人： Hirokazu Iizuka , Kunihiro Takei , Yuiko Maruyama , Yuki Sato
IPC分类号： C09J7/20 , B32B37/12 , B32B38/00 , C09J7/30 , C09J123/26 , C09J151/06 , C09J163/04
CPC分类号： C09J123/26 , B32B37/12 , B32B38/0036 , C09J7/20 , C09J7/30 , C09J151/06 , C09J163/04 , C08L2201/56 , Y10T428/287 , C09J151/06 , C08L63/04
摘要： The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film. More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.5 parts by mass or more and less than 50 parts by mass in a solid content of an epoxy resin having a novolac structure, and an organic solvent; a method for bonding adherends including forming an adhesive layer on a first adherend by applying the adhesive resin composition and drying, and then bonding a second adherend to the adhesive layer by laminating the second adherend on the adhesive layer; and an adhesive resin film including a first adhesive layer, a substrate layer, and a second adhesive layer in that order, in which any one or both of the first adhesive layer and the second adhesive layer include(s) the adhesive resin composition.
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公开(公告)号：US11904577B2
公开(公告)日：2024-02-20
申请号：US17034334
申请日：2020-09-28
发明人： Kunihiro Takei , Yuiko Maruyama , Hirokazu Iizuka
IPC分类号： B32B7/12 , B32B27/08 , B29C48/08 , B29C48/21 , B29C48/00 , B32B27/32 , B32B27/38 , C09J125/08 , C09J123/26 , C08L23/06 , C08L23/20 , C09J7/35 , B32B27/00 , C09J151/06 , C09J163/00 , C09J7/29 , B32B27/20 , B32B27/30 , B32B27/34 , B05D1/26 , B29K9/00 , B29K19/00 , B29K23/00 , B29K33/00 , B29K63/00 , B29K105/00
CPC分类号： B32B27/08 , B29C48/022 , B29C48/08 , B29C48/21 , B32B27/00 , B32B27/20 , B32B27/302 , B32B27/32 , B32B27/325 , B32B27/327 , B32B27/34 , B32B27/38 , C08L23/06 , C08L23/20 , C09J7/29 , C09J7/35 , C09J123/26 , C09J125/08 , C09J151/06 , C09J163/00 , B05D1/265 , B29K2009/00 , B29K2019/00 , B29K2023/06 , B29K2023/12 , B29K2033/08 , B29K2063/00 , B29K2105/0097 , B32B2250/05 , B32B2250/24 , B32B2250/40 , B32B2270/00 , B32B2307/306 , B32B2405/00 , C09J2301/124 , C09J2301/304 , C09J2423/006 , C09J2451/00 , C09J2463/00 , Y10T428/2813 , Y10T428/2848 , C09J2451/00 , C09J2463/00 , C09J151/06 , C08L51/003 , C08L23/06 , C08L23/12 , C08L53/025 , C08L23/20 , C08L23/22 , C08L23/12
摘要： A hot-melt adhesive resin film includes a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer include an acid-modified polyolefin resin.
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公开(公告)号：US11826991B2
公开(公告)日：2023-11-28
申请号：US17476409
申请日：2021-09-15
发明人： Kunihiro Takei , Yuiko Maruyama , Hirokazu Iizuka
IPC分类号： B32B7/12 , B32B27/08 , B32B27/32 , C09D123/26 , C09D5/00 , C09J123/26 , C09J201/00 , B32B27/00 , C09J151/06 , B32B37/00 , C09J7/29 , C09J7/35 , B32B27/20 , B32B27/30 , B32B27/34 , B32B27/36 , B32B27/38 , B32B37/12 , B32B37/18 , B05D5/10
CPC分类号： B32B27/08 , B32B27/00 , B32B27/20 , B32B27/302 , B32B27/32 , B32B27/325 , B32B27/34 , B32B27/36 , B32B27/38 , B32B37/00 , B32B37/12 , B32B37/185 , C09D5/00 , C09D123/26 , C09J7/29 , C09J7/35 , C09J123/26 , C09J151/06 , C09J201/00 , B05D5/10 , B32B2250/03 , B32B2250/24 , B32B2250/40 , B32B2255/10 , B32B2255/26 , B32B2270/00 , B32B2307/306 , B32B2307/732 , B32B2323/10 , B32B2325/00 , B32B2363/00 , B32B2367/00 , B32B2377/00 , B32B2405/00 , C09J2301/124 , C09J2301/304 , C09J2301/414 , C09J2423/00 , C09J2423/006 , C09J2423/106 , C09J2451/00 , C09J2463/00 , C09J2467/006 , C09J2479/08 , Y10T428/287 , Y10T428/2813 , Y10T428/2848 , C09J2451/00 , C09J2463/00 , C09J151/06 , C08L51/003
摘要： The present invention relates to a hot-melt adhesive resin film having an excellent adhesive force and durability to various adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order, in which the first intermediate layer and the second intermediate layer include a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and a production method thereof.
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公开(公告)号：US11710881B2
公开(公告)日：2023-07-25
申请号：US17198393
申请日：2021-03-11
IPC分类号： H01M50/571 , H01M50/562 , H01M50/553 , H01M50/197 , H01M50/198 , H01M50/186 , H01M50/193 , H01M50/178
CPC分类号： H01M50/571 , H01M50/178 , H01M50/186 , H01M50/193 , H01M50/197 , H01M50/198 , H01M50/553 , H01M50/562
摘要： Provided are an electrode lead wire member including a sealing film having high adhesive strength and resistance to an electrolytic solution, and a battery including the electrode lead wire member. Provided is an electrode lead wire member including: a derivation portion extending in one direction; a surface-treated layer formed, at the derivation portion, on a surface of the derivation portion; and a sealing film provided in contact with the surface-treated layer, in which the sealing film has an adhesive resin layer in contact with the surface-treated layer, and the adhesive resin layer contains imine-modified polyolefin or modified polyolefin having a carbodiimide group.
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公开(公告)号：US11242475B2
公开(公告)日：2022-02-08
申请号：US16052615
申请日：2018-08-02
发明人： Hirokazu Iizuka , Kunihiro Takei , Jun Suzuki
IPC分类号： C09J123/26 , C09J151/06
摘要： Provided are an adhesive resin composition having high adhesiveness and high strength in acid resistance, and a laminate including the same. Provided is an adhesive resin composition including an acid-modified polyolefin resin component (A) having a weight average molecular weight of 30,000 or more and 150,000 or less, a resin component (B) having an epoxy group in a molecule, a resin component (C) having an amino group at a molecular end, and a solvent (S), in which a content of the resin component (B) is 1 part by mass or more and 30 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A), and a content of the resin component (C) is 0.5 parts by mass or more and 15 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A).
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公开(公告)号：US10669456B2
公开(公告)日：2020-06-02
申请号：US16052617
申请日：2018-08-02
发明人： Hirokazu Iizuka , Kunihiro Takei , Jun Suzuki
IPC分类号： C09J123/26 , C09J151/06
摘要： Provided are an adhesive resin composition that can be uniformly applied, has high adhesiveness, and further has high strength in acid resistance, and a laminate including the same. Provided is an adhesive resin composition including an acid-modified polyolefin resin component having a melting point of higher than 80° C. and 140° C. or lower, a crosslinking agent component, and a solvent component, in which the solvent component contains an aromatic solvent, an aliphatic solvent, and a ketone-based solvent, the aromatic solvent has a highest boiling point, and the solvent component contains the aromatic solvent in an amount of 50 parts by mass or more and 80 parts by mass or less, the aliphatic solvent in an amount of 10 parts by mass or more and 30 parts by mass or less, and the ketone-based solvent in an amount of 5 parts by mass or more and 20 parts by mass or less, based on 100 parts by mass of a total amount of the solvent component.
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公开(公告)号：US11359117B2
公开(公告)日：2022-06-14
申请号：US16074945
申请日：2016-12-12
发明人： Hirokazu Iizuka , Kunihiro Takei , Yuiko Maruyama , Yuki Sato
IPC分类号： B32B7/12 , C09J123/26 , C09J7/20 , C09J163/04 , C09J151/06 , C09J7/30 , B32B37/12 , B32B38/00
摘要： The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.5 parts by mass or more and less than 50 parts by mass in a solid content of an epoxy resin having a novolac structure, and an organic solvent; a method for bonding adherends including forming an adhesive layer on a first adherend by applying the adhesive resin composition and drying, and then bonding a second adherend to the adhesive layer by laminating the second adherend on the adhesive layer; and an adhesive resin film including a first adhesive layer, a substrate layer, and a second adhesive layer in that order, in which any one or both of the first adhesive layer and the second adhesive layer include(s) the adhesive resin composition.
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