Invention Grant
- Patent Title: Wiring incorporated resin pipe and method of manufacturing the same
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Application No.: US15713602Application Date: 2017-09-22
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Publication No.: US10670171B2Publication Date: 2020-06-02
- Inventor: Shouma Nishino , Takashi Morimoto , Hideo Mine , Masashi Tanaka
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6c3e38f6
- Main IPC: F16L9/00
- IPC: F16L9/00 ; A47L9/24 ; B29C70/72 ; H02G3/04 ; B29C45/14 ; B29C70/74 ; B29C70/32 ; B32B1/08 ; F16L9/12 ; F16L11/00 ; F16L47/03 ; B29L31/34 ; B29C45/26 ; B29K101/10 ; B29L23/00

Abstract:
A wiring incorporated resin pipe includes a tubular shaped sheet formed in an approximately tubular shape at an interval so that a slit is formed between both ends in a transverse direction, a wiring unit arranged in the tubular shaped sheet along a longitudinal direction of the slit in an inner side of the slit and a resin material filled in a gap formed by matching surfaces of the slit of the tubular shaped sheet and the wiring unit to thereby seal the matching surfaces of the slit of the tubular shape sheet, in which conductive wires for wiring are laid inside the wiring unit in the longitudinal direction.
Public/Granted literature
- US20180119848A1 WIRING INCORPORATED RESIN PIPE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-05-03
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