Invention Grant
- Patent Title: Electronic component
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Application No.: US16507978Application Date: 2019-07-10
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Publication No.: US10672562B2Publication Date: 2020-06-02
- Inventor: Ho Yoon Kim , Sang Soo Park , Woo Chul Shin
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5be65047
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/40 ; H01G4/30

Abstract:
An electronic component includes: a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes, and an interposer including an interposer body having grooves and a pair of external terminals. Each of the external terminals includes a bonding portion, a mounting portion and a connection portion; and ΔL=|A−A′|/2 in which A is a distance from one end portion of the interposer in a length direction to one end portion of the multilayer ceramic capacitor in the length direction, A′ is a distance from the other end portion of the interposer in the length direction to the other end portion of the multilayer ceramic capacitor in the length direction, and ΔL is an offset between the multilayer ceramic capacitor and the interposer in the length direction, and ΔL/L≤0.100 in which L is a length of the multilayer ceramic capacitor.
Public/Granted literature
- US20200090870A1 ELECTRONIC COMPONENT Public/Granted day:2020-03-19
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