-
公开(公告)号：US11276528B2
公开(公告)日：2022-03-15
申请号：US16849681
申请日：2020-04-15
发明人： Man Su Byun , Ho Yoon Kim , Soo Hwan Son
摘要： An electronic component includes a multilayer capacitor, including a capacitor body and first and second external electrodes disposed on both ends of the capacitor body, respectively, in a first direction, and a interposer including an interposer body and first and second external terminals in a second direction. The capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes exposed through the both ends of the capacitor body, respectively. The first and second external terminals each include a first layer including CuNi, a second layer covering the first layer and including copper (Cu), a third layer covering the second layer and including nickel (Ni), and a fourth layer covering the third layer and including tin (Sn), which are sequentially disposed from a respective inner side of the first and second external terminals.
-
公开(公告)号：US10937581B2
公开(公告)日：2021-03-02
申请号：US16266617
申请日：2019-02-04
发明人： Ho Yoon Kim , Yu Jin Choi , Soo Hwan Son , Min Kyoung Cheon
摘要： A hybrid inductor includes an inductor body having a core part in which a coil part is disposed, and first and second cover parts having the core part interposed therebetween. The core part includes magnetic metal layers, and the first and second cover parts include ferrite layers.
-
公开(公告)号：US10910157B2
公开(公告)日：2021-02-02
申请号：US16195399
申请日：2018-11-19
发明人： Ho Yoon Kim , Sang Soo Park , Woo Chul Shin
IPC分类号： H01G2/02 , H01G4/30 , H01G4/232 , H01G4/248 , H01G4/002 , H05K1/18 , H01G4/12 , H01G4/008 , H01G4/012
摘要： An electronic component includes a multilayer capacitor, including a capacitor body, and a pair of external electrodes disposed on both ends of the capacitor body, respectively, and an interposer, including an interposer body, and a pair of external terminals disposed on both ends of the interposer body, respectively. The external terminals include bonding portions, mounting portions, and connection portions disposed to connect the bonding portions and the mounting portions to each other. Adhesives are provided between the external electrodes and the bonding portion. A height at which the adhesives fall along the connection portions of the external terminals is defined as t and a height of the interposer is defined as T, t/T satisfies 0.04≤t/T≤0.80.
-
公开(公告)号：US10672562B2
公开(公告)日：2020-06-02
申请号：US16507978
申请日：2019-07-10
发明人： Ho Yoon Kim , Sang Soo Park , Woo Chul Shin
摘要： An electronic component includes: a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes, and an interposer including an interposer body having grooves and a pair of external terminals. Each of the external terminals includes a bonding portion, a mounting portion and a connection portion; and ΔL=|A−A′|/2 in which A is a distance from one end portion of the interposer in a length direction to one end portion of the multilayer ceramic capacitor in the length direction, A′ is a distance from the other end portion of the interposer in the length direction to the other end portion of the multilayer ceramic capacitor in the length direction, and ΔL is an offset between the multilayer ceramic capacitor and the interposer in the length direction, and ΔL/L≤0.100 in which L is a length of the multilayer ceramic capacitor.
-
公开(公告)号：US10542626B2
公开(公告)日：2020-01-21
申请号：US16001510
申请日：2018-06-06
发明人： Ho Yoon Kim , Kyung Hwa Yu , Man Su Byun , Dae Heon Jeong , Min Kyoung Cheon , Soo Hwan Son
摘要： A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes and having first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes including first and second connected portions respectively disposed on the third and fourth surfaces of the capacitor body and first and second band portions respectively extending from the first and second connected portions to portions of the first surface of the capacitor body, respectively; a first connection terminal disposed on the first band portion; and a second connection terminal disposed on the second band portion, wherein 0.05≤A1/A1≤0.504, where A1 is an area of the first or second connection terminal in a thickness-width direction, and A2 is an area of the first or second band portion in a width-length direction.
-
公开(公告)号：US11328870B2
公开(公告)日：2022-05-10
申请号：US16852808
申请日：2020-04-20
发明人： Ho Yoon Kim , Yeong Lim Kwon
摘要： An electronic component includes a multilayer capacitor including a capacitor body having first to sixth surfaces, and first and second external electrodes; and an interposer including an interposer body and first and second external terminals; and the capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes, the first and second internal electrodes are exposed through the third and fourth surfaces of the capacitor body, respectively, and the interposer further includes first and second solder fillet limiting layers disposed on upper sides of both surfaces of each of the first and second external terminals in the first direction, respectively.
-
公开(公告)号：US11206737B2
公开(公告)日：2021-12-21
申请号：US16856444
申请日：2020-04-23
发明人： Man Su Byun , Ho Yoon Kim , Kyung Hwa Yu , Dae Heon Jeong , Min Kyoung Cheon , Soo Hwan Son
IPC分类号： H05K1/18 , H01G4/30 , H01G4/232 , H01G4/002 , H01G4/40 , H01G2/06 , H05K3/30 , H01G4/12 , H05K1/11 , H05K3/34
摘要： A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.
-
公开(公告)号：US11166375B2
公开(公告)日：2021-11-02
申请号：US16691787
申请日：2019-11-22
发明人： Man Su Byun , Ho Yoon Kim , Kyung Hwa Yu , Dae Heon Jeong , Min Kyoung Cheon , Soo Hwan Son
IPC分类号： H05K1/18 , H01G4/30 , H01G4/232 , H01G4/002 , H01G4/40 , H01G2/06 , H05K3/30 , H01G4/12 , H05K1/11 , H05K3/34
摘要： A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.
-
公开(公告)号：US11037730B2
公开(公告)日：2021-06-15
申请号：US16200373
申请日：2018-11-26
发明人： Ho Yoon Kim , Woo Chul Shin , Sang Soo Park
摘要： An electronic component includes a body; first and second external electrodes including first and second connection portions and first and second band portions, respectively; and first and second metal frames connected to the first and second external electrodes, respectively, wherein the first and second metal frames include first and second support portions bonded to the first and second connection portions, and first and second mounting portions extended in the first direction from lower ends of the first and second support portions and spaced apart from the body and the first and second external electrodes, and further include first and second insulating layers formed on external surfaces of the first and second support portions.
-
公开(公告)号：US20210175019A1
公开(公告)日：2021-06-10
申请号：US16849681
申请日：2020-04-15
发明人： Man Su Byun , Ho Yoon Kim , Soo Hwan Son
摘要： An electronic component includes a multilayer capacitor, including a capacitor body and first and second external electrodes disposed on both ends of the capacitor body, respectively, in a first direction, and a interposer including an interposer body and first and second external terminals in a second direction. The capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes exposed through the both ends of the capacitor body, respectively. The first and second external terminals each include a first layer including CuNi, a second layer covering the first layer and including copper (Cu), a third layer covering the second layer and including nickel (Ni), and a fourth layer covering the third layer and including tin (Sn), which are sequentially disposed from a respective inner side of the first and second external terminals.
-
-
-
-
-
-
-
-
-
搜索结果
49 条记录 (耗时 0.022 秒)
