Invention Grant
- Patent Title: Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package
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Application No.: US16431808Application Date: 2019-06-05
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Publication No.: US10672678B2Publication Date: 2020-06-02
- Inventor: Heinrich Koerner , Michael Bauer , Reimund Engl , Michael Huettinger , Werner Kanert , Joachim Mahler , Brigitte Ruehle
- Applicant: INFINEON TECHNOLOGIES AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner MBB
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@19b390ea
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/495 ; H01L21/56

Abstract:
In various embodiments, methods for forming a chip package are provided. The chip package may include a chip comprising a chip metal surface, a metal contact structure electrically contacting the chip metal surface, a packaging material at least partially encapsulating the chip and the metal contact structure, and a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure, wherein the chemical compound may be configured to improve an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound, wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium.
Public/Granted literature
- US20190287875A1 METHODS FOR FORMING A CHIP PACKAGE Public/Granted day:2019-09-19
Information query
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