Invention Grant
- Patent Title: Silicon carbide semiconductor device
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Application No.: US16255875Application Date: 2019-01-24
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Publication No.: US10672878B2Publication Date: 2020-06-02
- Inventor: Atsushi Ohoka , Nobuyuki Horikawa , Masao Uchida
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@b294bf9
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/06 ; H01L29/10 ; H01L23/528 ; H01L29/417 ; H01L29/66 ; H01L29/739 ; H01L29/78 ; H01L29/16

Abstract:
The silicon carbide semiconductor device includes a plurality of unit cells each having an MISFET structure and provided on a silicon carbide semiconductor substrate. A gate upper electrode disposed adjacent to the plurality of unit cells includes a gate pad and gate global wires. When viewed in plan, gate electrodes do not overlap with the gate pad.
Public/Granted literature
- US20190245052A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2019-08-08
Information query
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