A memory extensible chip (200) is provided. The chip (200) includes a substrate (240), and a processor (230), a first memory module set (210), and a second memory module set (220) that are integrated on the substrate (240). The processor (230) communicates with at least one memory module in the first memory module set (210) using a first communications interface (250), and the processor (230) communicates with at least one memory module in the second memory module set (220) using a second communications interface (260). A memory module in the first memory module set (210) communicates with a memory module in the second memory module set (220) using a substrate network, where the substrate network is a communications network located inside the substrate (240). In this way, the processor (230) can access a memory module in the first memory module set (210) by using the second memory module set (220).