Invention Grant
- Patent Title: Substrate support assembly with deposited surface features
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Application No.: US16007977Application Date: 2018-06-13
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Publication No.: US10679885B2Publication Date: 2020-06-09
- Inventor: Wendell Glenn Boyd, Jr. , Vijay D. Parkhe , Teng-Fang Kuo , Zhenwen Ding
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/687 ; C03C17/00 ; G03F7/20 ; H02N13/00
Abstract:
An electrostatic chuck comprises a ceramic body comprising an embedded electrode and a first ceramic coating on a surface of the ceramic body, wherein the first ceramic coating fills pores in the ceramic body. The electrostatic chuck further comprises a second ceramic coating on the first ceramic coating and a plurality of elliptical mesas on the second ceramic coating, the plurality of elliptical mesas having rounded edges.
Public/Granted literature
- US20180301364A1 SUBSTRATE SUPPORT ASSEMBLY WITH DEPOSITED SURFACE FEATURES Public/Granted day:2018-10-18
Information query
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