Invention Grant
- Patent Title: Semiconductor package and a substrate for packaging
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Application No.: US15499446Application Date: 2017-04-27
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Publication No.: US10679932B2Publication Date: 2020-06-09
- Inventor: Chang-Fu Lin , Ho-Yi Tsai , Chin-Tsai Yao
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5b32d51a
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L23/498 ; H01L21/56 ; H01L23/29 ; H01L23/31 ; H01L23/367
Abstract:
A semiconductor package is provided, which includes: a substrate having a metal pattern layer; a semiconductor die formed on the substrate; and an underfill filled between the substrate and the semiconductor die. At least an opening is formed in the metal pattern layer to reduce the area of the metal pattern layer on the substrate, thereby reducing the contact area between the underfill and the metal pattern layer, hence eliminating the underfill delamination.
Public/Granted literature
- US20170294371A1 SEMICONDUCTOR PACKAGE AND A SUBSTRATE FOR PACKAGING Public/Granted day:2017-10-12
Information query
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