Invention Grant
- Patent Title: Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
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Application No.: US16357627Application Date: 2019-03-19
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Publication No.: US10680023B2Publication Date: 2020-06-09
- Inventor: Hartmut Rudmann , Mario Cesana , Jens Geiger , Peter Roentgen , Vincenzo Condorelli
- Applicant: ams Sensors Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: ams Sensors Singapore Pte. Ltd.
- Current Assignee: ams Sensors Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Michael Best & Friedrich LLP
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L27/146
Abstract:
Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.
Public/Granted literature
- US20190326340A1 OPTOELECTRONIC MODULES HAVING A SILICON SUBSTRATE, AND FABRICATION METHODS FOR SUCH MODULES Public/Granted day:2019-10-24
Information query
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