Invention Grant
- Patent Title: Lithography method
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Application No.: US16516452Application Date: 2019-07-19
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Publication No.: US10684561B2Publication Date: 2020-06-16
- Inventor: Hao-Yu Lan , Po-Chung Cheng , Ching-Juinn Huang , Tzung-Chi Fu , Tsung-Yen Lee
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: G03F9/00
- IPC: G03F9/00

Abstract:
A method includes the following operations. A reference image of a mask having a plurality of mapping marks is acquired. A lithography exposing process is performed by a scanner with the mask to a photoresist layer which is formed on a substrate. Performing the lithography exposing process includes mapping a real-time image of the mask with the reference image of the mask.
Public/Granted literature
- US20200133143A1 LITHOGRAPHY METHOD Public/Granted day:2020-04-30
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