Invention Grant
- Patent Title: Contour pocket and hybrid susceptor for wafer uniformity
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Application No.: US15616364Application Date: 2017-06-07
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Publication No.: US10685864B2Publication Date: 2020-06-16
- Inventor: Kaushal Gangakhedkar , Kallol Bera , Joseph Yudovsky
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/683 ; H01L21/67
Abstract:
Susceptor assemblies comprising a susceptor base and a plurality of pie-shaped skins thereon are described. A pie anchor can be positioned in the center of the susceptor base to hold the pie-shaped skins in place during processing.
Public/Granted literature
- US20170352575A1 Contour Pocket And Hybrid Susceptor For Wafer Uniformity Public/Granted day:2017-12-07
Information query
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