Invention Grant
- Patent Title: Electronic device structure formed from porous metal bonded to plastic
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Application No.: US15267081Application Date: 2016-09-15
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Publication No.: US10688624B2Publication Date: 2020-06-23
- Inventor: James R. Krogdahl , Derek C. Krass , Paul Choiniere
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: B24C1/04
- IPC: B24C1/04 ; C25D11/04 ; B29C45/14 ; H04M1/02 ; H05K5/06 ; B29K101/12 ; B29K705/00 ; B29K105/20

Abstract:
A composite material is disclosed which includes a plastic layer formed on a layer of metal. The metal layer includes pores into which an adhesive is introduced. The plastic layer is injection molded onto the metal layer so as to contact the adhesive in the pores. The plastic layer is thus bonded to the metal layer.
Public/Granted literature
- US20170094824A1 ELECTRONIC DEVICE STRUCTURE FORMED FROM POROUS METAL BONDED TO PLASTIC Public/Granted day:2017-03-30
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