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公开(公告)号：US20230301408A1
公开(公告)日：2023-09-28
申请号：US18197646
申请日：2023-05-15
Applicant: APPLE INC.
Inventor： Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: A45C11/00 , H04R5/033 , A45C13/02 , H02J50/10 , H04R1/10 , H04R1/28 , H04R1/34 , B65D25/02 , B65D43/16 , H04R1/02 , H04B1/3888 , H04B5/00 , A45C11/24 , A45C13/10 , H04R9/02 , H04R9/06 , H02J7/00 , H01R13/52 , A45C13/00
CPC classification number: A45C11/00 , A45C11/24 , A45C13/005 , A45C13/02 , A45C13/1069 , B65D25/02 , B65D43/16 , H01R13/521 , H02J7/0044 , H02J50/10 , H04B1/3888 , H04B5/0037 , H04R1/02 , H04R1/1016 , H04R1/1025 , H04R1/1041 , H04R1/1058 , H04R1/1075 , H04R1/2826 , H04R1/345 , H04R5/033 , H04R9/025 , H04R9/06 , A45C2011/001 , A45C2013/026 , H02J7/00034 , H04B1/385 , H04R2420/07 , H04R2460/09 , H04R2460/17
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号：US11690428B2
公开(公告)日：2023-07-04
申请号：US17131610
申请日：2020-12-22
Applicant: Apple Inc.
Inventor： Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: A45C11/00 , H04R5/033 , A45C13/02 , H02J50/10 , H04R1/10 , H04R1/28 , H04R1/34 , B65D25/02 , B65D43/16 , H04R1/02 , H04B1/3888 , H04B5/00 , A45C11/24 , A45C13/10 , H04R9/02 , H04R9/06 , H02J7/00 , H01R13/52 , A45C13/00 , H04B1/3827 , H04M1/60 , F16B1/00
CPC classification number: A45C11/00 , A45C11/24 , A45C13/005 , A45C13/02 , A45C13/1069 , B65D25/02 , B65D43/16 , H01R13/521 , H02J7/0044 , H02J50/10 , H04B1/3888 , H04B5/0037 , H04R1/02 , H04R1/1016 , H04R1/1025 , H04R1/1041 , H04R1/1058 , H04R1/1075 , H04R1/2826 , H04R1/345 , H04R5/033 , H04R9/025 , H04R9/06 , A45C2011/001 , A45C2013/026 , F16B2001/0035 , H02J7/00034 , H04B1/385 , H04M1/6033 , H04R1/2857 , H04R2201/105 , H04R2420/07 , H04R2460/03 , H04R2460/09 , H04R2460/17
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号：US20200275184A1
公开(公告)日：2020-08-27
申请号：US16870373
申请日：2020-05-08
Applicant: Apple Inc.
Inventor： Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: H04R1/10 , A45C11/00 , H04R5/033 , A45C13/02 , H04R1/28 , H04R1/34 , B65D25/02 , B65D43/16 , H04R1/02 , H04B1/3888 , H04B5/00 , A45C11/24 , A45C13/10 , H04R9/02 , H04R9/06 , H02J7/00 , H01R13/52 , A45C13/00
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号：US09219515B2
公开(公告)日：2015-12-22
申请号：US14019369
申请日：2013-09-05
Applicant: Apple Inc.
Inventor： Paul Choiniere , Christopher D. Prest , Dale N. Memering , Matthew S. Rogers , Michael K. Pilliod
IPC: B32B3/10 , H04B1/3888 , B32B38/10 , B32B27/06 , B32B27/28 , B32B3/08 , B32B37/24 , B32B37/12 , H04M1/02 , H04M1/18
CPC classification number: H04B1/3888 , B32B3/085 , B32B3/10 , B32B17/064 , B32B27/06 , B32B27/281 , B32B37/12 , B32B38/10 , B32B2037/243 , B32B2037/246 , B32B2307/412 , B32B2307/558 , B32B2457/20 , B32B2571/00 , B32B2605/006 , H04M1/0266 , H04M1/185 , Y10T156/10 , Y10T428/24802 , Y10T428/24868
Abstract: A protective film configured to protect a substrate such as a glass panel for a display is provided. The protective film may include a discontinuous outer layer including a multitude of panels and gaps positioned therebetween. Further, the protective film may include a flexible layer positioned between the discontinuous outer layer and the substrate. When panels of the discontinuous outer layer are impacted by a foreign object, the force may be transferred to the flexible layer, rather than propagating through the outer layer. In this regard, the gaps between the panels of the discontinuous outer layer may prevent the formation of cracks that may otherwise occur. Related assemblies and methods are also provided.
Abstract translation: 提供了一种保护膜，用于保护用于显示器的玻璃面板等基板。 保护膜可以包括不连续的外层，其包括位于其间的多个面板和间隙。 此外，保护膜可以包括位于不连续外层和基板之间的柔性层。 当不连续外层的面板被异物撞击时，该力可以传递到柔性层，而不是传播通过外层。 在这方面，不连续外层的板之间的间隙可以防止可能出现的裂纹的形成。 还提供了相关的组件和方法。
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公开(公告)号：US20150284868A1
公开(公告)日：2015-10-08
申请号：US14742637
申请日：2015-06-17
Applicant: Apple Inc.
Inventor： Ken Silverman , Ronald Moller , Peter Russell-Clarke , Christopher D. Prest , Rimple Bhatia , Paul Choiniere , Lucy Elizabeth Browning , Masashige Tatebe
CPC classification number: C25D3/44 , C25D3/665 , C25D5/02 , C25D5/022 , C25D5/10 , C25D5/48 , C25D7/00 , C25D11/022 , C25D11/024 , C25D11/04 , C25D11/12 , C25D11/14 , C25D11/16 , C25D11/18 , C25D11/243 , C25D11/246 , H04M1/0283 , H05K5/04 , Y10T428/12611 , Y10T428/12764
Abstract: Anodized electroplated aluminum structures and methods for making the same are disclosed. Cosmetic structures according to embodiments of the invention are provided by electroplating a non-cosmetic structure with aluminum and then anodizing the electroplated aluminum. This produces cosmetic structures that may possess desired structural and cosmetic properties and that may be suitable for use as housing or support members of electronic devices.
Abstract translation: 公开了阳极化电镀铝结构及其制造方法。 根据本发明实施例的化妆品结构通过用铝电镀非化妆品结构，然后对电镀铝进行阳极氧化来提供。 这产生了可以具有期望的结构和化妆品性质并且可以适合用作电子设备的外壳或支撑构件的化妆品结构。
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Patent Agency Ranking
公开(公告)号：US20210274273A1
公开(公告)日：2021-09-02
申请号：US17306683
申请日：2021-05-03
Applicant: Apple Inc.
Inventor： Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: H04R1/10 , A45C11/00 , H04R5/033 , A45C13/02 , H02J50/10 , H02J7/00 , H04R1/28 , H04R1/34 , B65D25/02 , B65D43/16 , H04R1/02 , H04B1/3888 , H04B5/00 , A45C11/24 , A45C13/10 , H04R9/02 , H04R9/06 , H01R13/52 , A45C13/00
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号：US11026010B2
公开(公告)日：2021-06-01
申请号：US16870373
申请日：2020-05-08
Applicant: Apple Inc.
Inventor： Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: H04R1/10 , A45C11/00 , H04R5/033 , A45C13/02 , H02J50/10 , H02J7/00 , H04R1/28 , H04R1/34 , B65D25/02 , B65D43/16 , H04R1/02 , H04B1/3888 , H04B5/00 , A45C11/24 , A45C13/10 , H04R9/02 , H04R9/06 , H02J7/02 , H01R13/52 , A45C13/00 , H04B1/3827 , H04M1/60 , F16B1/00
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号：US20200288229A1
公开(公告)日：2020-09-10
申请号：US16882020
申请日：2020-05-22
Applicant: Apple Inc.
Inventor： Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: H04R1/10 , A45C11/00 , H04R5/033 , A45C13/02 , H04R1/28 , H04R1/34 , B65D25/02 , B65D43/16 , H04R1/02 , H04B1/3888 , H04B5/00 , A45C11/24 , A45C13/10 , H04R9/02 , H04R9/06 , H02J7/00 , H01R13/52 , A45C13/00
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号：US20190289383A1
公开(公告)日：2019-09-19
申请号：US16430853
申请日：2019-06-04
Applicant: Apple Inc.
Inventor： Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: H04R1/10 , A45C11/24 , H02J7/02 , A45C13/02 , H04R1/28 , H04R1/34 , B65D25/02 , B65D43/16 , H04R1/02 , H04B1/3888 , H04B5/00 , A45C13/10 , A45C13/00 , H04R5/033 , A45C11/00 , H01R13/52 , H02J7/00 , H04R9/06 , H04R9/02
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号：US20190261509A1
公开(公告)日：2019-08-22
申请号：US16212453
申请日：2018-12-06
Applicant: Apple Inc.
Inventor： Kevin M. Froese , Qian Zhang , Paul Choiniere , Derek C. Krass
Abstract: Dielectric such as polyether ether ketone may be used in forming radio-frequency flexible printed circuits. Filler may be incorporated into the dielectric to adjust the coefficient of thermal expansion of the flexible printed circuit. One or more layers of the flexible printed circuit may be unfilled and one or more layers of the flexible printed circuit may be filled. Antennas may be formed from metal traces on the flexible printed circuit, metal electronic device housing structures, or other conductive structures. A transmission line on the flexible printed circuit may couple radio-frequency transceiver circuitry in an electronic device to an antenna. A flexible printed circuit may have a portion with enhanced bendability in a location that overlaps a bend region. The enhanced bendability region may have less filler than other portions of the flexible printed circuit.
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