Invention Grant
- Patent Title: Honeycomb structure forming die
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Application No.: US15664429Application Date: 2017-07-31
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Publication No.: US10688706B2Publication Date: 2020-06-23
- Inventor: Yuta Imaizumi , Kazuhiko Hamatsuka
- Applicant: NGK INSULATORS, LTD.
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@46716a0d com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2365680d
- Main IPC: B29C48/11
- IPC: B29C48/11 ; B28B3/26 ; B29C48/30 ; B29C48/00 ; B29L31/60

Abstract:
The honeycomb structure forming die includes a first die in which a central region on the side of a kneaded material discharging surface has a convex region projecting toward a downstream side in an extruding direction of a kneaded material, a ring-shaped second die, and a reticulated member interposed between the first die and the second die. In the first die, first kneaded material introducing holes are formed and latticed first slits are formed on the side of the kneaded material discharging surface of the convex region, and in the second die, there are formed second kneaded material introducing holes and latticed second slits communicating with the second kneaded material introducing holes, and movement of a kneaded material is performed between the first kneaded material introducing hole and the second kneaded material introducing hole through meshes of the reticulated member.
Public/Granted literature
- US20180043597A1 HONEYCOMB STRUCTURE FORMING DIE Public/Granted day:2018-02-15
Information query
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