Invention Grant
- Patent Title: Metrology technique that provides true flattening
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Application No.: US16171735Application Date: 2018-10-26
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Publication No.: US10690697B1Publication Date: 2020-06-23
- Inventor: Zhiyong Xiao , Gary Kunkel , Dan Dinh
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Fremont
- Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee Address: US CA Fremont
- Agency: Westman, Champlin & Koehler, P.A.
- Main IPC: G01Q30/04
- IPC: G01Q30/04 ; G01Q60/24 ; G01Q80/00 ; G06T7/00

Abstract:
An apparatus and method for topographically characterizing a workpiece. The method includes scanning a first surface of a workpiece with a scanning probe at a first resolution to derive a first topographical image, and performing a refining operation on the first topographical image to obtain a true first topographical image. The method also includes scanning, with the scanning probe, a surface of interest of the workpiece, which is a sub-portion of the first surface, at a second resolution that is higher than the first resolution to derive a second topographical image. The second topographical image is scaled down to the first resolution. The method further includes performing a pattern recognition operation to substantially match the scaled-down second topographical image to a corresponding sub-portion of the true first topographical image. The matched sub-portion of the true first topographical image is employed to refine the second topographical image.
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