Invention Grant
- Patent Title: Methods and apparatus for reducing sputtering of a grounded shield in a process chamber
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Application No.: US13798021Application Date: 2013-03-12
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Publication No.: US10692706B2Publication Date: 2020-06-23
- Inventor: Alan Ritchie , John C. Forster , Muhammad Rasheed
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: H01J37/34
- IPC: H01J37/34 ; H01J37/32 ; C23C14/34
Abstract:
Methods and apparatus for physical vapor deposition are provided herein. In some embodiments, a process kit shield for use in a physical vapor deposition chamber may include an electrically conductive body having one or more sidewalls defining a central opening, wherein the body has a ratio of a surface area of inner facing surfaces of the one or more sidewalls to a height of the one or more sidewalls of about 2 to about 3.
Public/Granted literature
- US20140262764A1 METHODS AND APPARATUS FOR REDUCING SPUTTERING OF A GROUNDED SHIELD IN A PROCESS CHAMBER Public/Granted day:2014-09-18
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