Invention Grant
- Patent Title: Flip chip assembly of quantum computing devices
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Application No.: US16188466Application Date: 2018-11-13
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Publication No.: US10692795B2Publication Date: 2020-06-23
- Inventor: Jae-Woong Nah , Hanhee Paik , Jerry M. Chow
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Garg Law Firm, PLLC
- Agent Rakesh Garg; Keivan Razavi
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L23/367 ; H01L39/22 ; H01L23/544 ; H01L23/00 ; H01L39/04 ; G06N10/00 ; H01L23/498

Abstract:
In an embodiment, a quantum device includes an interposer layer comprising a set of vias. In an embodiment, the quantum device includes a dielectric layer formed on a first side of the interposer, the dielectric layer including a set of transmission lines communicatively coupled to the set of vias. In an embodiment, the quantum device includes a plurality of qubit chips coupled to an opposite side of the interposer layer, each qubit chip of the plurality of qubit chips including: a plurality of qubits on a first side of the qubit chip and a plurality of protrusions on a second side of the qubit chip. In an embodiment, the quantum device includes a heat sink thermally coupled with the plurality of qubit chips, the heat sink comprising a plurality of recesses aligned with the plurality of protrusions of the plurality of qubit chips.
Public/Granted literature
- US20200152540A1 FLIP CHIP ASSEMBLY OF QUANTUM COMPUTING DEVICES Public/Granted day:2020-05-14
Information query
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