Invention Grant
- Patent Title: Interconnects with variable space mandrel cuts formed by block patterning
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Application No.: US15980085Application Date: 2018-05-15
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Publication No.: US10692812B2Publication Date: 2020-06-23
- Inventor: Ravi Prakash Srivastava , Hui Zang , Jiehui Shu
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Thompson Hine LLP
- Agent Anthony Canale
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/522 ; H01L21/768 ; H01L21/308 ; H01L21/02 ; H01L21/033
Abstract:
Methods of fabricating an interconnect structure. A hardmask is deposited over an interlayer dielectric layer, and a block mask is formed that covers an area on the hardmask. A sacrificial layer is formed over the block mask and the hardmask, and the sacrificial layer is patterned to form a mandrel that extends across the block mask.
Public/Granted literature
- US20190355658A1 INTERCONNECTS WITH VARIABLE SPACE MANDREL CUTS FORMED BY BLOCK PATTERNING Public/Granted day:2019-11-21
Information query
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