Invention Grant
- Patent Title: IC structure with air gap adjacent to gate structure and methods of forming same
-
Application No.: US16164867Application Date: 2018-10-19
-
Publication No.: US10692987B2Publication Date: 2020-06-23
- Inventor: Haiting Wang , Guowei Xu , Hui Zang
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Hoffman Warnick LLC
- Agent Francois Pagette
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/49 ; H01L23/535 ; H01L21/768 ; H01L29/78

Abstract:
The disclosure provides an integrated circuit (IC) structure including a first spacer on a semiconductor fin adjacent a first portion of the gate structure, and having a first height above the semiconductor fin; a second spacer on the semiconductor fin adjacent the first spacer, such that the first spacer is horizontally between the first portion of the gate structure and a lower portion of the outer; and a gate cap positioned over the first portion of the gate structure and on the second spacer above the semiconductor fin. The gate cap defines an air gap horizontally between the first portion of the gate structure and an upper portion of the second spacer, and vertically between an upper surface of the first spacer and a lower surface of the gate cap.
Public/Granted literature
- US20200127109A1 IC STRUCTURE WITH AIR GAP ADJACENT TO GATE STRUCTURE AND METHODS OF FORMING SAME Public/Granted day:2020-04-23
Information query
IPC分类: