Invention Grant
- Patent Title: Heat pump system with multi-way-position valve
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Application No.: US15877432Application Date: 2018-01-23
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Publication No.: US10697681B2Publication Date: 2020-06-30
- Inventor: Jing He , Loren John Lohmeyer , William Stewart Johnston , Angelo Patti
- Applicant: Ford Global Technologies, LLC
- Applicant Address: US MI Dearborn
- Assignee: FORD GLOBAL TECHNOLOGIES, LLC
- Current Assignee: FORD GLOBAL TECHNOLOGIES, LLC
- Current Assignee Address: US MI Dearborn
- Agency: Brooks Kushman P.C.
- Agent David Coppiellie
- Main IPC: F25B49/02
- IPC: F25B49/02 ; B60H1/32 ; B60H1/00 ; F25B29/00 ; F25B13/00 ; F25B40/00 ; F25B9/00

Abstract:
A vehicle heat pump system including a thermal loop, an eight-way valve, and a controller is provided. The thermal loop includes a compressor, a first portion, and a second portion. The first portion includes an outside heat exchanger. The second portion includes a cabin heat exchanger. The eight-way valve is downstream of the compressor and has a first position in which refrigerant flows within the portions in a cooling mode and a second position in which refrigerant flows within the portions in a heating mode. The controller switches the eight-way valve between the first and second positions. The outside heat exchanger operates as a condenser in the cooling mode and the eight-way valve directs refrigerant flow from the outside heat exchanger to the cabin heat exchanger.
Public/Granted literature
- US20190226737A1 Heat Pump System with Multi-Way-Position Valve Public/Granted day:2019-07-25
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