- 专利标题: Wafer scale bonded active photonics interposer
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申请号: US15891847申请日: 2018-02-08
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公开(公告)号: US10698156B2公开(公告)日: 2020-06-30
- 发明人: Douglas Coolbaugh , Douglas La Tulipe , Gerald Leake
- 申请人: The Research Foundation for The State University of New York
- 申请人地址: US NY Albany
- 专利权人: The Research Foundation for the State University of New York
- 当前专利权人: The Research Foundation for the State University of New York
- 当前专利权人地址: US NY Albany
- 代理机构: Heslin Rothenberg Farley & Mesiti P.C.
- 代理商 George S. Blasiak, Esq.
- 主分类号: G02B6/12
- IPC分类号: G02B6/12 ; H01L21/48 ; H01L23/498 ; H01L31/02 ; H01L31/0232 ; G02B6/13
摘要:
There is set forth herein a method including building an interposer base structure on a first wafer having a first substrate, wherein the building an interposer base structure includes fabricating a plurality of through vias that extend through the first substrate and fabricating within an interposer base dielectric stack formed on the first substrate one or more metallization layer; building a photonics structure on a second wafer having a second substrate, wherein the building a photonics structure includes fabricating within a photonics device dielectric stack formed on the second substrate one or more photonics device; and bonding the photonics structure to the interposer base structure to define an interposer having the interposer base structure and one or more photonics device fabricated within the photonics device dielectric stack. There is set forth herein an optoelectrical system including a substrate; an interposer dielectric stack formed on the substrate, the interposer dielectric stack including a base interposer dielectric stack, and a photonics device dielectric stack, and a bond layer dielectric stack that integrally bonds the photonics device dielectric stack to the base interposer dielectric stack.
公开/授权文献
- US20180314003A1 WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER 公开/授权日:2018-11-01