Invention Grant
- Patent Title: On-boarding and provisioning devices using ultrasonic wave communications
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Application No.: US15086785Application Date: 2016-03-31
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Publication No.: US10700791B2Publication Date: 2020-06-30
- Inventor: Yamin S. Al-Mousa , Assaf Mevorach , Vijay Sarathi Kesavan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H04B11/00
- IPC: H04B11/00 ; H04W12/00 ; H04M1/725 ; H04W48/16

Abstract:
Techniques for communicating configuration information with remote devices using ultrasonic audio are disclosed. In an example, provisioning and device onboarding operations are initiated by a configuration computing device to a plurality of configurable devices, through operations that encode configuration data into an ultrasonic audio signal (e.g., emitted at 18 kHz or greater) and broadcast this ultrasonic audio signal with a speaker. The respective configurable devices may then perform operations to receive the ultrasonic audio signal with a microphone, decode the configuration data from the ultrasonic audio signal, and configure settings based on the configuration data. This configuration data may include network connection information to onboard the respective configurable devices to connection with a wireless local area network (e.g., a Wi-Fi network). This configuration data may also communicate information to enable the respective configurable device to access a provisioning server, used to obtain additional network or configuration settings.
Public/Granted literature
- US20170288786A1 ON-BOARDING AND PROVISIONING DEVICES USING ULTRASONIC WAVE COMMUNICATIONS Public/Granted day:2017-10-05
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