Invention Grant
- Patent Title: Low profile component tie
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Application No.: US14954464Application Date: 2015-11-30
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Publication No.: US10703548B2Publication Date: 2020-07-07
- Inventor: Nicholas John Swatko , Thomas D. Ratzlaff
- Applicant: TYCO ELECTRONICS CORPORATION
- Applicant Address: unknown Schaffhausen
- Assignee: TE CONNECTIVITY SERVICES GMBH
- Current Assignee: TE CONNECTIVITY SERVICES GMBH
- Current Assignee Address: unknown Schaffhausen
- Main IPC: B65D63/10
- IPC: B65D63/10

Abstract:
A low profile component tie includes a strap having a top and a bottom. The strap is configured to wrap around a component with the bottom facing the component. The strap has sides between the top and the bottom. The strap has teeth disposed along at least one of the sides. The strap extends between a root end and a distal end. A head is provided at the root end of the strap. The head has a channel configured to receive the strap. The head has at least one pawl provided in the channel. The pawl engages at least one of the teeth along the side of the strap to secure the strap in the head.
Public/Granted literature
- US20170152087A1 LOW PROFILE COMPONENT TIE Public/Granted day:2017-06-01
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