Invention Grant
- Patent Title: LED filament and light bulb
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Application No.: US16662485Application Date: 2019-10-24
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Publication No.: US10704741B2Publication Date: 2020-07-07
- Inventor: Tao Jiang , Liqin Li
- Applicant: JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
- Applicant Address: CN Zhejiang
- Assignee: JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
- Current Assignee: JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
- Current Assignee Address: CN Zhejiang
- Agency: Roberts Calderon Safran & Cole, P.C.
- Agent Andrew M. Calderon
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@214857c3 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@196aa9df com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5a77237 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@64fdc556 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7e86045 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4b001536 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7508f0ab com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7fd54c29 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3b7bf1de com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7019ea22
- Main IPC: F21K9/232
- IPC: F21K9/232 ; H01L33/62 ; F21V3/02 ; F21K9/238 ; H01L25/075 ; F21Y115/10 ; F21V3/06 ; F21Y107/50 ; F21Y107/00 ; F21Y103/33 ; F21K9/90 ; F21Y103/37 ; F21V19/00

Abstract:
An LED light bulb comprises an LED filament configured for emitting omnidirectional light. The filament comprises a linear array of LED chips operably interconnected to emit light upon energization, a conductive electrode electrically connected with the linear array of LED chips, and a light conversion coating enclosing the linear array of the LED chip and the electrode. The light conversion coating includes a top layer and a base layer conformally interconnected to form a unitary enclosure. The top layer is coated on a first side of the linear array of LED chips and the electrode. The base layer is coated on a second side of the linear array of LED chips and the electrode. A first LED chip in the linear array of LED chips is guided by the unitary enclosure to a different angle in relation to a second LED chip in the linear array of the LED chips.
Public/Granted literature
- US20200056747A1 LED FILAMENT AND LIGHT BULB Public/Granted day:2020-02-20
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