Invention Grant
- Patent Title: Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods
-
Application No.: US16197438Application Date: 2018-11-21
-
Publication No.: US10707201B2Publication Date: 2020-07-07
- Inventor: Jonathan M. Rothberg , Keith G. Fife , Nevada J. Sanchez , Susan A. Alie
- Applicant: Butterfly Network, Inc.
- Applicant Address: US CT Guilford
- Assignee: Butterfly Network, Inc.
- Current Assignee: Butterfly Network, Inc.
- Current Assignee Address: US CT Guilford
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: B81B3/00
- IPC: B81B3/00 ; B81B7/00 ; H01L21/56 ; H01L21/8238 ; H01L23/522 ; H01L23/528 ; H01L27/06 ; B06B1/02 ; H01L27/092 ; B81C1/00 ; H01L21/3213 ; H01L21/768 ; A61B8/00
Abstract:
Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.
Public/Granted literature
Information query
