- Patent Title: Radio frequency (RF) shielding structure for RF connector to microwave transmission interconnect regions and methods for manufacturing such RF shielding structure
-
Application No.: US15884756Application Date: 2018-01-31
-
Publication No.: US10709011B2Publication Date: 2020-07-07
- Inventor: Susan C. Trulli , Christopher M. Laighton , Elicia K. Harper
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Daly, Crowley, Mofford & Durkee, LLP
- Main IPC: H05K1/02
- IPC: H05K1/02 ; G06F1/18 ; H05K9/00 ; H01R13/719 ; H01R13/6599 ; H01R24/50 ; H01R9/05 ; H01P5/08 ; H01R13/6584 ; H01R24/44 ; H01R12/72

Abstract:
An electrically conductive shield for a microwave transmission line-electrical connector interconnect region wherein the microwave transmission line is connected to the electrical connector. An elastic, dielectric material is disposed between opposing surfaces of the dielectric structure and the housing. An electrically conductive material is disposed on an outer surface of the elastic, dielectric material to provide an electrically conductive shield. The electrically conductive shield is disposed over the opposing surfaces of the dielectric structure and the housing.
Public/Granted literature
Information query