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公开(公告)号：US10511076B2
公开(公告)日：2019-12-17
申请号：US15693743
申请日：2017-09-01
Applicant: Raytheon Company
Inventor： Christopher M. Laighton , Susan C. Trulli , Elicia K. Harper
IPC: H01P5/18
Abstract: An RF coupler having: a pair of input ports; a pair of output ports; and a coupling region for coupling: a portion of an input signal at a first one of the input ports to first of the pair of output ports and another portion of the input signal fed to the first one of the input ports a second one of the output ports; and one portion of an input signal fed to a second one of the input ports to the second of the pair of output ports and another portion of the input signals fed to the second one of the input ports to the second one of the output ports. The coupling region comprises a plurality of serially connected, vertically stacked, coupling sections. Each one of a plurality of electrically conductive layers is disposed between a pair of the vertically stacked coupling sections.
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公开(公告)号：US20190313522A1
公开(公告)日：2019-10-10
申请号：US15948404
申请日：2018-04-09
Applicant: Raytheon Company
Inventor： Susan C. Trulli , Christopher M. Laighton
IPC: H05K1/02 , H05K1/18 , H01L23/66 , H01L23/367 , H01L25/065 , H01L25/00 , H05K3/12 , H01L23/538 , H01L21/48 , H03F1/30 , H03F3/195 , H03F3/21 , H03F3/213 , H01L25/16 , H01L21/56 , H05K3/34 , H01L25/18
Abstract: A MMIC support and cooling structure having a three-dimensional, thermally conductive support structure having a plurality of surfaces and a circuit having a plurality of heat generating electrical components disposed on a first portion of the surfaces and interconnected by microwave transmission lines disposed on a second portion of the plurality of surfaces of the thermally conductive support structure
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公开(公告)号：US10276282B2
公开(公告)日：2019-04-30
申请号：US15663128
申请日：2017-07-28
Applicant: Raytheon Company
Inventor： Angelo M. Puzella , Lance A. Auer , Norman Armendariz , Donald A. Bozza , John B. Francis , Philip M. Henault , Randal W. Oberle , Susan C. Trulli , Dimitry Zarkh
Abstract: A coaxial transmission line structure having a center conductor section having an input contact and an output contact the output contact being larger than the input contact, the center conductor having a plurality of different geometrically shaped, electrically conductive layers having sizes progressively increasing from the input contact to the larger output contact to conductor transition from the input contact to the larger output contact, the electrically conductive layers being electrically interconnected by staggered microvias passing through dielectric layers to the center, and (B) an outer conductor section disposed about, coaxial with, and electrically isolated from, the center conductor by the dielectric layers.
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公开(公告)号：US20180134000A1
公开(公告)日：2018-05-17
申请号：US15870155
申请日：2018-01-12
Applicant: Raytheon Company
Inventor： Susan C. Trulli
CPC classification number: B32B1/08 , B32B7/12 , B32B9/007 , B32B9/041 , B32B2255/06 , B32B2255/205 , B32B2307/302 , B32B2457/00 , B32B2597/00 , F28F13/00 , F28F21/02 , F28F2013/006 , H01L23/373 , H01L23/3736 , H05K7/2039
Abstract: An anisotropic thermal conduit having an outer cylindrical tube; and an anisotropic thermal material disposed with the outer cylindrical tube.
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5.发明授权Patterned conductive epoxy heat-sink attachment in a monolithic microwave integrated circuit (MMIC) 有权单片微波集成电路（MMIC）中的图案导电环氧散热器附件公开(公告)号：US09318450B1
公开(公告)日：2016-04-19
申请号：US14551358
申请日：2014-11-24
Applicant: Raytheon Company
Inventor： Shahed Reza , David H. Altman , Susan C. Trulli
IPC: H01L23/66 , H01L23/367 , H01L23/535
CPC classification number: H01L24/29 , H01L23/3731 , H01L23/3737 , H01L23/42 , H01L23/66 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/33 , H01L24/73 , H01L2223/6627 , H01L2223/6683 , H01L2224/131 , H01L2224/14165 , H01L2224/16225 , H01L2224/16235 , H01L2224/27312 , H01L2224/29013 , H01L2224/29078 , H01L2224/2929 , H01L2224/29339 , H01L2224/29387 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2924/10272 , H01L2924/1033 , H01L2924/1423 , H01L2924/15313 , H01L2924/014 , H01L2924/0665 , H01L2924/0503 , H01L2924/01005 , H01L2924/05032 , H01L2924/00014 , H01L2924/00
Abstract: A monolithic microwave integrated circuit structure having: a semiconductor substrate structure having a plurality of active devices and a microwave transmission line having an input section, an output section and a interconnecting section electrically interconnecting the active devices on one surface of the substrate; a thermally conductive, electrically non-conductive heat sink; and a thermally conductive bonding layer for bonding the heat sink to the substrate, the thermally conductive bonding layer having an electrically conductive portion and an electrically non-conductive portion, the electrically conductive portion being disposed between the heat sink and an opposite surface of a portion of the substrate having the active devices and the electrically non-conductive portion being disposed on the opposite surface portion overlaying portion of the microwave transmission line section.
Abstract translation: 一种单片微波集成电路结构，具有：具有多个有源器件的半导体衬底结构和具有输入部分，输出部分和互连部分的微波传输线，所述互连部分将衬底的一个表面上的有源器件电连接; 导热的，不导电的散热器; 以及用于将散热器接合到基板的导热接合层，所述导热接合层具有导电部分和非导电部分，所述导电部分设置在散热器与部分的相对表面之间 具有有源器件的衬底和非导电部分设置在微波传输线部分的相对表面部分覆盖部分上。
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Patent Agency Ranking
公开(公告)号：US20250145845A1
公开(公告)日：2025-05-08
申请号：US18504518
申请日：2023-11-08
Applicant: Raytheon Company , The University of Massachusetts
Inventor： Gavin Alexander , Andrew M. Luce , Christopher Areias , Craig Alfred Armiento , Susan C. Trulli , Alkim Akyurtlu , Oshada K. Ranasingha
Abstract: A method of forming a convertible ink. The method includes: performing a polyol process with a metal salt, a capping agent and a solvent to produce encapsulated nanospheres in a first aqueous solution; reducing the amount of capping agent in the solution. The capping agent can be reduced by: adding solvent soluble with the capping agent and agitating the mixture via centrifugation to form a supernatant and a precipitate that includes the encapsulated nanospheres; removing the supernatant; adding a second solvent to the precipitate to form a second solution; agitating the second solution to form a second supernatant and a precipitate that includes the encapsulated nanospheres; and removing the second supernatant.
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公开(公告)号：US20230332003A1
公开(公告)日：2023-10-19
申请号：US18134785
申请日：2023-04-14
Applicant: Raytheon Company , The University of Massachusetts
Inventor： Yuri Piro , Susan C. Trulli , Craig Alfred Armiento , Christopher R. Areias , Alkim Akyurtlu , James Reuther
IPC: C09D11/101 , C09D11/03 , C09D11/108 , B41M7/00
CPC classification number: C09D11/101 , C09D11/03 , C09D11/108 , B41M7/009
Abstract: A printable dielectric ink composition includes an inhibited catalyst-polymer complex and a crosslinker, wherein the printable dielectric ink composition has a viscosity of about 1 to about 10 cP.
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公开(公告)号：US10709011B2
公开(公告)日：2020-07-07
申请号：US15884756
申请日：2018-01-31
Applicant: Raytheon Company
Inventor： Susan C. Trulli , Christopher M. Laighton , Elicia K. Harper
IPC: H05K1/02 , G06F1/18 , H05K9/00 , H01R13/719 , H01R13/6599 , H01R24/50 , H01R9/05 , H01P5/08 , H01R13/6584 , H01R24/44 , H01R12/72
Abstract: An electrically conductive shield for a microwave transmission line-electrical connector interconnect region wherein the microwave transmission line is connected to the electrical connector. An elastic, dielectric material is disposed between opposing surfaces of the dielectric structure and the housing. An electrically conductive material is disposed on an outer surface of the elastic, dielectric material to provide an electrically conductive shield. The electrically conductive shield is disposed over the opposing surfaces of the dielectric structure and the housing.
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公开(公告)号：US10374280B2
公开(公告)日：2019-08-06
申请号：US15621150
申请日：2017-06-13
Applicant: Raytheon Company
Inventor： Christopher M. Laighton , Susan C. Trulli , Elicia K. Harper
Abstract: A quadrature coupler having: a pair of overlying strip conductors separated by a first dielectric layer to provide a coupling region between the coupling region of overlying strip conductors; a pair of opposing ground pads, the coupling region being disposed between the pair of opposing ground pads; a second dielectric layer disposed over the coupling region and between the pair of opposing ground pads; and an electrically conductive shield layer disposed over the second dielectric layer, extending over opposing sides of the dielectric layer and onto the pair of opposing ground pads. Portions of coupler are formed by printing or additive manufacturing.
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公开(公告)号：US20180358675A1
公开(公告)日：2018-12-13
申请号：US15615984
申请日：2017-06-07
Applicant: Raytheon Company
Inventor： Christopher M. Laighton , Susan C. Trulli , Elicia K. Harper
CPC classification number: H01P3/006 , G02F1/2257 , H01P3/003 , H01P3/026 , H01P3/06
Abstract: A microwave transmission line structure having a pair of ground strip conductors on a surface of a dielectric substrate structure. A signal strip conductor is disposed on the surface of the dielectric substrate structure between the pair of ground strip conductors. A solid dielectric layer is disposed over: the signal strip conductor; the upper surface of the dielectric substrate structure between sides of each one of the ground strip conductors; and the signal strip conductor. An electrically conductive shield member is disposed on the solid dielectric layer and on, and in direct contact with, upper surfaces of the pair of ground strip conductors. The structure is used on each one of a plurality of proximate microwave transmission lines formed on the substrate structure to electrically isolate the transmission line.
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