- 专利标题: Semiconductor structure
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申请号: US16247867申请日: 2019-01-15
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公开(公告)号: US10714410B1公开(公告)日: 2020-07-14
- 发明人: Cheng-Tsung Wu , Shin-Cheng Lin , Hsiao-Ling Chiang , Wen-Hsin Lin
- 申请人: Vanguard International Semiconductor Corporation
- 申请人地址: TW Hsinchu
- 专利权人: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
- 当前专利权人: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
- 当前专利权人地址: TW Hsinchu
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L29/06 ; H01L29/78 ; H01L23/532
摘要:
A semiconductor structure including a substrate, a first well, a field oxide layer, a first conductive line and a second conductive line is provided. The substrate has a first conductivity type. The first well is formed on the substrate and has a second conductivity type. The field oxide layer is disposed on the first well. The first conductive line is formed on the field oxide layer and is in direct contact with the field oxide layer. The second conductive line is formed on the field oxide layer and is in direct contact with the field oxide layer. The first conductive line is spaced apart from the second conductive line.
公开/授权文献
- US20200227342A1 SEMICONDUCTOR STRUCTURE 公开/授权日:2020-07-16
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