- 专利标题： Crosstalk mitigation for PCB to die transition in superconducting devices
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申请号： US16513957申请日： 2019-07-17
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公开(公告)号： US10716202B2公开(公告)日： 2020-07-14
- 发明人: Salvatore Bernardo Olivadese
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 代理机构： Amin, Turocy & Watson, LLP
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L23/66 ; H01L23/00 ; H05K9/00 ; H05K1/02 ; H04B3/32 ; G06N10/00 ; H01L27/18
摘要：
The subject disclosure relates generally to a method of implementing magnetic shielding walls with specific respective dimensions to reduce crosstalk between transmission lines in wire-bonds for supercomputing chipsets. In one embodiment, the device comprises: a chip-set comprised of superconducting materials; at least one superconducting data line attached to chip-set dies by a set of wire bonds; and magnetic shielding walls that respectively isolate the set of wire bonds.
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