Invention Grant
- Patent Title: Stacked base heat sink with heat pipes in-line with airflow
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Application No.: US16198542Application Date: 2018-11-21
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Publication No.: US10721838B1Publication Date: 2020-07-21
- Inventor: Rakesh Bhatia , Eric Michael Lotter
- Applicant: CISCO TECHNOLOGY, INC.
- Applicant Address: US CA San Jose
- Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee Address: US CA San Jose
- Agent Cindy Kaplan
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/18 ; H05K1/02 ; H01L23/467 ; H01L23/367
Abstract:
In one embodiment, a heat sink includes a lower base, an upper base, a set of fins interposed between the lower base and the upper base, and a plurality of heat pipes running between the lower base and the upper base on opposite sides of the heat sink and in-line with an airflow direction through the set of fins. An apparatus comprising a plurality of the heat sinks is also disclosed herein.
Information query
