公开(公告)号：US10721838B1

公开(公告)日：2020-07-21

申请号：US16198542

申请日：2018-11-21

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Rakesh Bhatia ,  Eric Michael Lotter

IPC: H05K7/20 ,  H05K1/18 ,  H05K1/02 ,  H01L23/467 ,  H01L23/367

Abstract: In one embodiment, a heat sink includes a lower base, an upper base, a set of fins interposed between the lower base and the upper base, and a plurality of heat pipes running between the lower base and the upper base on opposite sides of the heat sink and in-line with an airflow direction through the set of fins. An apparatus comprising a plurality of the heat sinks is also disclosed herein.