Invention Grant
- Patent Title: Laser sparing for photonic chips
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Application No.: US16132109Application Date: 2018-09-14
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Publication No.: US10725240B2Publication Date: 2020-07-28
- Inventor: Jock T. Bovington , Matthew J. Traverso
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson + Sheridan, LLP
- Main IPC: G02B6/12
- IPC: G02B6/12 ; H01S5/026 ; H04B10/25

Abstract:
A method comprises receiving, at a plurality of optical distributors of a photonic chip, optical energy from a plurality of primary laser sources. Each of the optical distributors receives optical energy from a respective primary laser source at a respective first input. The method further comprises detecting a failed primary laser source of the primary laser sources using control circuitry of a sparing system. The sparing system further comprises one or more secondary laser sources configured to provide optical energy to respective second inputs of the optical distributors. A first one of the secondary laser sources is optically coupled with at least two of the optical distributors. The method further comprises controlling, using the control circuitry, a first one of the secondary laser sources to selectively provide optical energy to the optical distributor whose first input is optically coupled with the failed primary laser source.
Public/Granted literature
- US20200088940A1 LASER SPARING FOR PHOTONIC CHIPS Public/Granted day:2020-03-19
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